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Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International

Date 20-22 May 1991

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Displaying Results 1 - 25 of 30
  • IEEE/SEMI International Semiconductor Manufacturing Science Symposium (Cat. No.91CH2993-4)

    Publication Year: 1991
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    Freely Available from IEEE
  • Performance evaluation of lot dispatching and scheduling algorithms through discrete event simulation

    Publication Year: 1991 , Page(s): 21 - 24
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (304 KB)  

    The effect of wafer factory production rules on factory capacity, WIP (work in process), and cycle time is investigated. Algorithms involving lot start rules, equipment loading rules, and lot priority assignment rules are evaluated. Specific rules are found optimum for the factory analyzed here. The spread between worst-case and best-case operating rules is quantified. More importantly, during the... View full abstract»

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  • Utilizing an integrated yield management system to improve the return on investment in IC manufacturing

    Publication Year: 1991 , Page(s): 25 - 29
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (492 KB)  

    The authors describe how a yield management system (YMS) could be designed to provide tools to quickly find and fix process and equipment defect problems in 16 Mbit DRAM IC manufacturing. The proposed system design consists of the KLA 2110 wafer inspection system (with sensitivity down to 0.25 μm for 16 Mbit DRAM manufacturing), optical and SEM (scanning electron microscope) defect review stati... View full abstract»

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  • Long term cost of ownership: beyond purchase price [chip manufacture]

    Publication Year: 1991 , Page(s): 39 - 43
    Cited by:  Papers (11)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (336 KB)  

    An economic cost of ownership model is developed to estimate the total cost per wafer for a given process operation. The model incorporates fixed and variable costs and process tool specific as well as fab specific cost inputs. While all the variables can affect the final outcome, it is shown that the long-term cost per wafer for a given process is directly proportional to both mechanical throughp... View full abstract»

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  • Manufacturing lithography value/cost analysis

    Publication Year: 1991 , Page(s): 44 - 54
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (688 KB)  

    A long-term value/cost of ownership model is presented which examines those parameters which most significantly differentiate lithography equipment and influence product innovation and productivity. These parameters are stepper throughput, overlay, yield, utilization, process automation, and a future technology path. Available market specifications for these stepper parameters are used in the mode... View full abstract»

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  • The IBM statistical process control implementation program: an interactive videodisc approach

    Publication Year: 1991 , Page(s): 1 - 3
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (284 KB)  

    IBM recently developed a unique training program to support statistical process control (SPC) needs. The mission was to create a high-quality laser interactive videodisc course for the IBM InfoWindow system. Specialists involved in the venture included professionals in the areas of script writing, video production, instructional design, testing, set design, art, and interactive videodisc productio... View full abstract»

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  • Equipment start-up in a manufacturing environment

    Publication Year: 1991 , Page(s): 55 - 61
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (376 KB)  

    The authors present the methodology used to install and start up a new plasma etcher for production in a 1.0 micron/CMOS manufacturing line. It was demonstrated that a coordinated effort by equipment engineering, process engineering, technology development, equipment maintenance, and a vendor/partner can result in a quality-oriented start up. A specification was written to incorporate the procedur... View full abstract»

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  • Efficient and practical experimental designs for high volume manufacturing

    Publication Year: 1991 , Page(s): 139 - 144
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (556 KB)  

    An experimental design technique that permits process optimization studies to extend beyond process average response curves and that optimizes with respect to primary (main) variables and secondary (tolerated) variables is described. The method modifies W.J. Diamond's (1981) approach for the inner array and modifies G. Taguchi's (1986) approach for a high-volume manufacturing environment and is ex... View full abstract»

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  • A new equipment management approach

    Publication Year: 1991 , Page(s): 4 - 7
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (208 KB)  

    An equipment management method that is based on analysis of productivity losses, search for best actors, adaption of structures, and training programs is discussed. It is concluded that the program, implemented on an active production line, increased equipment performance and enriched the tasks of all employees on the production line, enabling the establishment of a coherent staff evolution policy View full abstract»

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  • The UL ISO 9000 registration process

    Publication Year: 1991 , Page(s): 106 - 108
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (248 KB)  

    The ISO 9000 Series consists of five documents which address quality concepts, guidelines, system elements, and system models. The first standard, ISO 9000, describes quality concepts and provides guidelines for the use and selection of a specific quality system model. ISO 9001, 9002, and 9003 describe those quality system models. The ISO 9000 registration process is described here View full abstract»

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  • VLSI process monitoring system

    Publication Year: 1991 , Page(s): 136 - 138
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (188 KB)  

    The authors describe the development and implementation of an in-situ continuous monitoring system for B/323, a VLSI manufacturing line. B/323 is a Class 10 facility with 132000 sq. ft. of VLF cleanroom surrounded by a Class 10 K controlled perimeter. The manufacturing process in B/323 consists of micron and submicron semiconductor technologies. These technologies require defect densities of less ... View full abstract»

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  • Implementation of the SEMI `Generic Equipment Model' using object-based cell technology

    Publication Year: 1991 , Page(s): 102 - 105
    Cited by:  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (308 KB)  

    A method was sought for developing a general-purpose automation platform for a large-capacity 4 Mbit DRAM production facility. Various technological approaches were evaluated ranging from simple messaging systems to programmer toolkits to an `object-based cell' approach that meets the stated goal of `enabling' the process engineer. Because of the message passing and dynamic binding nature of objec... View full abstract»

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  • Bibliography of books and articles related to manufacturing: 1991

    Publication Year: 1991 , Page(s): 145 - 148
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (300 KB)  

    The bibliography presented is broken down into five major areas: just-in-time methodologies, corporate strategy, quality, financial methods, and periodicals. The bibliography is not exhaustive but aims to give a good cross section of the books and articles that cover the above topics View full abstract»

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  • Using full wafer defect maps as process signatures to monitor and control yield

    Publication Year: 1991 , Page(s): 129 - 135
    Cited by:  Papers (3)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (584 KB)  

    Experience with full-wafer data maps at many fabs has shown that defects on patterned wafers tend to cluster and be distributed in nonrandom patterns. The full-wafer defect map becomes a process signature which can be used to quickly determine if changes have occurred in the process. The authors show how the process signature map has been used in actual case studies to quickly identify process pro... View full abstract»

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  • Automation experiences on a new 1 micron production fab

    Publication Year: 1991 , Page(s): 95 - 97
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (296 KB)  

    The authors describe an operational automation system that addresses the need for more consistent, repeatable process execution without mistakes. This system manages and controls material flow throughout the semiconductor ASIC (application-specific integrated circuit) manufacturing process. The authors describe the system implementation experience and the lessons learned. Issues of process `step/e... View full abstract»

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  • Gaining competitive advantage through continuous improvement programs

    Publication Year: 1991 , Page(s): 69 - 74
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (508 KB)  

    The authors describe a unique use of statistical quality control (SQC) and statistical process control (SPC) techniques in a total quality management program designed to improve reliability and process capability in plasma etch systems. Although in this study an equipment manufacturing process is observed, this program paves the way for continuous improvement gains in all manufacturing cycles. The... View full abstract»

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  • Modeling the performance of cluster-based fabs

    Publication Year: 1991 , Page(s): 8 - 14
    Cited by:  Papers (17)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (732 KB)  

    The economic performance of cluster tools is evaluated by modeling a hypothetical cluster-based fab, where almost all of a 0.6-μm DRAM (dynamic random-access memory) process flow is performed in cluster tools. A conventional fab under the same cost constraint running the same flow is also modeled as a base for comparison. From this model, a number of inherent differences between cluster-based f... View full abstract»

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  • A new knowledge-based expert system for inspection of ULSI process flow

    Publication Year: 1991 , Page(s): 85 - 88
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (368 KB)  

    A knowledge-based expert system for ULSI manufacturing has been developed in order to describe and inspect the process flow and generate data automatically for wafer control and other systems, maintaining data compatibility for ULSI fabrication. This system consists of four subsystems: a process flow generation system, a process flow inspection system, a data generation system, and a data translat... View full abstract»

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  • Automated malfunction diagnosis of a plasma etcher

    Publication Year: 1991 , Page(s): 62 - 68
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (604 KB)  

    The authors present a prototype tool for real-time diagnosis of equipment malfunctions in IC fabrication processes. The approach taken focuses on integrating quantitative empirical models with qualitative knowledge-based methods. The diagnostic system uses evidential reasoning techniques to identify malfunctions by combining various sources of noisy information which originates chronologically fro... View full abstract»

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  • Industrial standards: the development process

    Publication Year: 1991 , Page(s): 35 - 38
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (364 KB)  

    It is pointed out that the development of industrial standards challenges standards setting bodies both intellectually and intrapersonally. The majority of these organizations depend upon the cooperative efforts of volunteers who are generally associated with companies that compete with each other in either the production or use of the commodity of interest. An historical perspective is provided w... View full abstract»

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  • Paperless manufacturing-a challenge now and in the future

    Publication Year: 1991 , Page(s): 89 - 94
    Cited by:  Papers (2)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (452 KB)  

    In 1988, VLSI San Antonio Wafer Fab was started with and continues to utilize a paperless CIM (computer-integrated manufacturing), engineering, and inventory system, including lot-based, time-event-based data tracking. The author describes the implementation of this paperless manufacturing system and the benefits derived in cycle time improvement, process improvement, wafer traceability, and real-... View full abstract»

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  • Designing particles out of the deposition process-titanium nitride films

    Publication Year: 1991 , Page(s): 124 - 128
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (524 KB)  

    A reactive sputtering process for deposition of high-quality TiN films was demonstrated. Continuous process/hardware improvement has enabled achievement of a robust TiN production process in VLSI manufacturing. The source of the particles produced during reactive sputtering has been identified. Analysis of the results indicates that the particles are produced at the target surface and are a strong... View full abstract»

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  • Measuring perceptions and expectations of service quality

    Publication Year: 1991 , Page(s): 98 - 101
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (240 KB)  

    The author describes a method of generating a set of survey questions for measuring the perceptions and expectations of service quality of goods and services flowing between units in a semiconductor manufacturing company. The results are presented in a graphical form that assists interpretation and discussion. In addition, the alignment of goals and objectives between the supplier and customer uni... View full abstract»

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  • Shop floor control in ASIC assembly

    Publication Year: 1991 , Page(s): 15 - 20
    Cited by:  Papers (1)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (308 KB)  

    The paperless integrated manufacturing system (PIMS), a tandem-based shop floor control system, and its implementation in ASIC (application-specific integrated circuit) final manufacturing are discussed. The lot tracking and data collection features of PIMS are reviewed. Production problem solving that utilizes a structured query language (SQL) to analyze the collected data is described. Two onlin... View full abstract»

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  • The intelligent microelectronics factory of the future

    Publication Year: 1991 , Page(s): 30 - 34
    Cited by:  Papers (7)  |  Patents (33)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (376 KB)  

    It is projected that semiconductor device manufacturing near the year 2000 will be carried out on silicon wafers as large as 300 mm in diameter. Minimum geometries will approach 0.18 μm for the 1024 Mbit DRAM. Chip (device) sizes will be as large as 450 sq. mm. This will require a new manufacturing paradigm. It is projected that the factory of the future will come very close to actual intellige... View full abstract»

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