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2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

21-25 Feb. 2010

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  • [Title page]

    Publication Year: 2010, Page(s): 1
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  • [2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - Spine]

    Publication Year: 2010, Page(s): 1
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  • CPMT

    Publication Year: 2010, Page(s): i
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  • [Copyright notice]

    Publication Year: 2010, Page(s): ii
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  • Welcome to SEMI-THERM 26

    Publication Year: 2010, Page(s):iii - iv
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  • Awards

    Publication Year: 2010, Page(s): v
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  • Harvey Rosten Award

    Publication Year: 2010, Page(s): ix
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  • SEMI-THERM 26 Program Committee

    Publication Year: 2010, Page(s):vii - viii
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  • Table of contents

    Publication Year: 2010, Page(s):x - xiv
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  • A world of opportunities: Technology is moving fast. Are you keeping up? [advertisement]

    Publication Year: 2010
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  • Looking for research results in thermal design, modeling, and application?

    Publication Year: 2010, Page(s): vii
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  • A simplified CFD modeling technique for Small Form factor Pluggable transceiver

    Publication Year: 2010, Page(s):1 - 6
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (355 KB) | HTML iconHTML

    Small Form-factor Pluggable (SFP) transceivers are commonly used in fiber optics based networks. Detailed CFD model demands a lot of mesh counts and is computationally prohibitive in system and board level simulations. In the present study, detailed SFP models have been simulated at 24 different boundary conditions consisted of four system airflow velocities, three power dissipations and two PCB b... View full abstract»

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  • Practical CFD modeling of synthetic air jets for thermal management of electronics

    Publication Year: 2010, Page(s):18 - 28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1277 KB) | HTML iconHTML

    This paper discusses experimental and theoretical results for several embodiments of pulsed air jet technology. Pulsed air jets, also called synthetic jets, require an implementation strategy that is quite different from steady-flow devices such as fans and blowers. Simply replacing a fan with a synthetic jet will most likely result in a failure to cool a device as intended. The principal goal of ... View full abstract»

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  • Characteristic length and cooling circle

    Publication Year: 2010, Page(s):7 - 13
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (745 KB) | HTML iconHTML

    Modular design, outsourcing and open innovation create a complex network of possible end product embodiments in product design for the consumer market. Analyzing each and every possibility in detail is out of the question as resources are limited and module details are often proprietary information. To meet this challenge the thermal engineer needs a feeling about what will and what will not work ... View full abstract»

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  • Investigations of cooling solutions for three-dimensional (3D) chip stacks

    Publication Year: 2010, Page(s):25 - 32
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (651 KB) | HTML iconHTML

    Three-dimensional (3D) chip stacks are receiving more attention for system performance enhancements. However, because of the higher circuit density, the cooling of 3D chip stacks gets more challenging. In conventional cooling methods, a heat sink or a micro-channel cooler is located at the top of the chip to dissipate the generated heat in a chip. In this paper, possible cooling methods from the b... View full abstract»

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  • A novel conduction-convection based cooling solution for 3D stacked electronics

    Publication Year: 2010, Page(s):33 - 40
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (765 KB) | HTML iconHTML

    The present investigation focuses on the design and thermal parametric study of a unique liquid interface thermal management solution for a 3D chip stack that is embedded within a cavity, in a radial heat sink cooled by an array of synthetic jet actuators. The heat sink module was previously reported by the authors, who achieved an overall heat transfer coefficient of ~70 W/m2.K. The ra... View full abstract»

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  • Thermal characterization of Fan-in Package-on-Packages

    Publication Year: 2010, Page(s):41 - 46
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (368 KB) | HTML iconHTML

    The 3D market continues to be driven by mobile applications. The technology integrates devices or packages in the vertical direction to achieve reduction in size and cost along with high performance, challenging IC package designers to maintain a low enough junction temperature without using fans and heat sinks. The study carried out in the paper investigates the effect of design criteria on the t... View full abstract»

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  • Thermo-mechanical simulative study for 3D vertical stacked IC packages with spacer structures

    Publication Year: 2010, Page(s):47 - 54
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1172 KB) | HTML iconHTML

    As the market demands for high performance, miniaturized, better reliability and lower-priced portable electronic products, the integration of a system into three-dimensional (3D) chip stacking packages are presently used to achieve these targets. Even though the miniaturization of system scaling, low power consumption and better electrical performance can be performed by 3DIC packaging technologi... View full abstract»

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  • Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric

    Publication Year: 2010, Page(s):55 - 58
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB) | HTML iconHTML

    Presently, stack-dice are used widely as low-power memory applications because thermal management of such 3D architecture as high-power processors inherits many thermal challenges. Inadequate thermal management of 3D-ICs leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly non-uniform and non-unidirectional due to many... View full abstract»

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  • The development of a valveless piezoelectric micropump

    Publication Year: 2010, Page(s):59 - 67
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (714 KB) | HTML iconHTML

    Previous studies have indicated that the performance of the micropump is influenced by the driving voltage, frequency, valves, and pump chambers. In this study, an innovative one-side actuating valveless micropump is proposed and developed to actuate liquid in one direction with high flow rates and pump heads. The three-dimensional, transition numerical models of the micropumps were also employed ... View full abstract»

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  • Thermal performance of a Direct-Bond-Copper Aluminum Nitride manifold-microchannel cooler

    Publication Year: 2010, Page(s):68 - 73
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (346 KB) | HTML iconHTML

    The presence of multiple thermally resistive layers in a standard power electronics package is a hindrance to thermal dissipation. By reducing the thermal stack and incorporating microchannel cold plates into the Aluminum Nitride substrate layer, significant improvement can be made. While parallel microchannel coolers have proved their faculty for single chip cooling, manifold microchannel coolers... View full abstract»

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  • Enhanced gaseous natural convection from micro-scale fin structures using acoustic stimulation

    Publication Year: 2010, Page(s):74 - 77
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (225 KB) | HTML iconHTML

    This paper investigates the effect of acoustic stimulation on natural convection heat transfer in micro-scale fin structures. Enhancement of heat transfer from electronic components enclosed within compact geometries is a key goal in thermal management. Among the techniques to enhance heat transfer, extended surface is a simple approach to achieve the goal. However, micro scale fin heat sinks have... View full abstract»

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  • Metal filament enhanced thermal energy storage applied to on-demand cooling of high power-density hand-held electronics

    Publication Year: 2010, Page(s):78 - 86
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB) | HTML iconHTML

    A thin-slab thermal energy storage volume with embedded metal filaments sandwiched between an electronics heat spreader plate and the hand-held unit skin is analyzed. A numerical model is created and results are compared with temperature responses of a plane 1-D pad containing no metal filaments. Results show the addition of fins reduces operating temperatures by 30% in addition to reducing the ph... View full abstract»

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  • Fabrication and characterization of carbon-aluminum thermal management composites

    Publication Year: 2010, Page(s):87 - 92
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (684 KB) | HTML iconHTML

    A carbon-based, aluminum composite material with low mass, high thermal conductivity and low coefficient of thermal expansion (CTE) has been developed and characterized in this study. The carbon-aluminum composite is fabricated by injecting molten aluminum into a porous graphitic carbon matrix using a high-pressure impregnation process. The CTE of the carbon-aluminum composite is 7 ppm/K, and the ... View full abstract»

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  • Alkali Silicate Glass based thermal coatings

    Publication Year: 2010, Page(s):93 - 99
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (807 KB) | HTML iconHTML

    This paper describes a family of composite materials that are based on Alkali Silicate Glass (ASG), which can be processed and cured at temperatures that are compatible with conventional electronics packaging processes. The focus of this paper is on ASG composite materials with high thermal conductivity filler materials for use as thermal encapsulants and adhesives in electronics packaging. Data a... View full abstract»

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