Date 9-11 Dec. 2009
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Displaying Results 1 - 25 of 188
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[Front matter]
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PDF (1874 KB)
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EPTC 2009 program overview: 9th - 11th December 2009
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PDF (649 KB)
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Technical sessions
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PDF (231 KB)
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Abstract listings
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PDF (563 KB)
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Author index
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PDF (128 KB)
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Affiliation index
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PDF (115 KB)
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Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
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PDF (1554 KB)
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Cu wire bonding with Cu BSOB for SiP & stacked die application: Challenges & solutions
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PDF (873 KB)
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The equivalent diameter of copper wire and gold wire based on the sweep stiffness evaluation in semiconductor packaging
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PDF (505 KB)
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Improving package assembly process yield for complex high density flip chip applications
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PDF (686 KB)
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Assembly of large dies fine pitch Cu/low-k FCBGA package with through silicon via (TSV) interposer
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PDF (636 KB)
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Experimental studies of the temperature dependence of mechanical solder material properties using nanoindentation
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PDF (1336 KB)
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BGA lead-free C5 solder system improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy
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PDF (1896 KB)
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Application of the latency insertion method to circuits with blackbox macromodel representation
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PDF (498 KB)
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Method for system-level signal and power integrity modeling of high-speed electronic packages
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PDF (1242 KB)
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