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Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Date 6-8 Oct. 1997

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  • 1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)

    Publication Year: 1997
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    Freely Available from IEEE
  • Index of presenters

    Publication Year: 1997, Page(s):v - vi
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    Freely Available from IEEE
  • Wire bonding process control using fuzzy logic

    Publication Year: 1997, Page(s):B63 - B66
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    This paper describes a method of setting parameters for the wire bonding process using a fuzzy logic controller. The design of the fuzzy engine and the development of rules based on operator experience are discussed. Bonded ball size and shear strength density are the specific characteristics controlled. Experimental testing with standard wire bonders has resulted in improved process control View full abstract»

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  • A site wide risk assessment at Intel Corporation in New Mexico

    Publication Year: 1997, Page(s):C13 - C15
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (240 KB)

    Intel New Mexico has received intense public scrutiny since the construction of Fab 11, RR4, RR5, and the supporting Central Utilities buildings. Community concerns about routine emissions of chemicals, and the potential accidental release had been raised individually and in public forums. While Intel has historically incorporated risk assessment and risk management into facility and process desig... View full abstract»

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  • Measurable improvements in cycle-time-constrained capacity

    Publication Year: 1997, Page(s):A21 - A24
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    This study uses simulation-based analysis to evaluate the operating practices of a high-volume, multiple-product semiconductor fab, with the goal of finding potential areas for productivity improvement that will yield a quantifiable increase in fab capacity. The parameters setup, batching, tool/operator dedication, lot release, and dispatch rule were studied. The analysis revealed that some of the... View full abstract»

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  • A tight flow control for job-shop fabrication lines with finite buffers

    Publication Year: 1997, Page(s):D31 - D34
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (508 KB)

    We propose WIP estimation how control method which serves as a countermeasure against the evaluating timelag problem and the throughput degradation problem with the conventional flow control method (push-pull method). The most important features of this method are: (1) how control based on WIP estimation and scheduling, (2) the breaking down of the entire schedule into individual lot schedules, an... View full abstract»

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  • Real time dispatch gets real time results

    Publication Year: 1997, Page(s):P1 - P5
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    Since the on-line dispatch system is the primary method of prioritizing and directing the flow of work through a paperless fab, it makes sense that we place high demands on a dispatching tool. The demands were met by ASI's RTD system. The flexibility and customizability that RTD offers allows us to execute dispatch logic using real-time factory systems data. We can apply unique rules to accommodat... View full abstract»

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  • Strategic inventory control for stable production [semiconductor wafer manufacture]

    Publication Year: 1997, Page(s):A1 - A4
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (356 KB)

    Our ASIC factory runs many different types of devices with small lot sizes, so there is a critical need to efficiently control the use of many different types of reticle sets. Under these conditions, we were barely able to control the level of inventory and still achieve low cycle time. Our purposal, therefore, was to shorten cycle time, maintain overall capacity and control inventories by: decrea... View full abstract»

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  • An integrated approach to planning and scheduling at Philips Semiconductors

    Publication Year: 1997, Page(s):D27 - D29
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    One of the most difficult environments for planning and scheduling is semiconductor fabrication. Some of these challenges include: high occurrence of breakdowns and scraps, highly fluctuating demands, interplant dependency, long lead-times with large numbers of iterative and complex processes, a diverse and rapidly evolving demand mix, and multiple production sites, geographic dispersion of fabric... View full abstract»

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  • A systematic approach for IC fab design

    Publication Year: 1997, Page(s):P15 - P18
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    Facilities design is crucial to the performance of IC fabs. It is important to speed up the planning and design processes of IC fabs to react to the rapid changes of products, technologies, and equipment in IC manufacturing industry. This paper proposes a systematic three-phase approach to the design of IC fabs: initial design, rough-cut design, and detailed design. Each phase can be implemented o... View full abstract»

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  • The application of lithography defect simulation to submicron CMOS yield improvement efforts

    Publication Year: 1997, Page(s):E35 - E38
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    Yield improvement efforts traditionally involve extensive experimental work aimed at diagnosing defects. This paper proposes supplementing such experimental work with defect simulation. An example of identifying a defect in the top antireflective coating (TARC) on photoresist illustrates yield improvement efforts involving both defect simulations and experimentation View full abstract»

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  • Noncontact inspection of opaque film thickness in single layer and multilayer structures and edge-exclusion zones

    Publication Year: 1997, Page(s):P35 - P37
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (244 KB)

    A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Ti, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of ... View full abstract»

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  • Thermal desorption behaviour of adsorbed materials on wafer surfaces

    Publication Year: 1997, Page(s):E5 - E8
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    The influence of organic contamination on dielectric breakdown of a gate oxide was evaluated. Preventing air exposure during wafer processing from gate oxidation through poly Si CVD was shown to result in lower defect densities, and results obtained with a thermal desorption spectrum-atmospheric pressure ionization mass spectrometer showed that were the source of organic contamination gases releas... View full abstract»

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  • New spin cleaner with megasonic for single wafer processing based on UCT cleaning concept

    Publication Year: 1997, Page(s):E9 - 12
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (272 KB)

    In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer's attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy.... View full abstract»

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  • Training time reduction in producing certified manufacturing technicians for a fabrication environment

    Publication Year: 1997, Page(s):A13 - A16
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    Intel's Fab 10 is challenged to quickly integrate new technologies into high volume manufacturing. This paper outlines how the Training Department in Fab 10 is supporting this challenge by creating new efficiencies and improvements in the delivery of Level 1 Certified Maintenance Technicians (MT) to the production floor. These efficiencies equate to a reduction of up to 30% in the Level 1 Certific... View full abstract»

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  • Maintenance-free, high efficiency treatment system for acidic gases

    Publication Year: 1997, Page(s):P53 - P56
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    We developed a highly removal efficient wet scrubbing system for removing various acidic gases in waste gas emitted by the semiconductor and other chemical industries. Especially significant are our system's high removal efficiency (>99%) and long-term maintenance free operation View full abstract»

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  • TPM activities at Motorola SCG America

    Publication Year: 1997, Page(s):B5 - B8
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    Cost control, equipment lifespans, and productivity are concerns for all semiconductor manufacturers. Equipment purchase prices are aggressively spiraling upward. The pressure to reduce wafer manufacturing costs is relentless. Total Productive Maintenance is one form of relief that allows a manufacturer to wring the most return from the equipment set. Motorola is attempting to use this methodology... View full abstract»

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  • 0.25 μm integrated circuit yield model design and validation

    Publication Year: 1997, Page(s):E21 - E24
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    This paper provides an overview of the design and the methods used to establish validated defect density targets for a 0.25 μm process tool set based on a new SEMATECH yield model. This is the first model to provide industry tool targets derived from real manufacturing data. Besides the model design and the model validation approach, the paper provides particles per wafer pass (PWP) tool target... View full abstract»

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  • Modeling and filtering of optical emission spectroscopy data for plasma etching systems

    Publication Year: 1997, Page(s):B41 - B44
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (380 KB)

    Full-spectrum in situ optical emission spectroscopy (OES) has emerged as a promising technology for in-line sensor systems for plasma etching process control. In this paper, we present a novel empirical model-based approach for OES data filtering based on statistical principal component analysis and jump linear filtering. The modeling procedure is demonstrated on a commercial multilayer Al/TiN/SiO... View full abstract»

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  • Philips Semiconductors (Albuquerque site) internal water reuse system

    Publication Year: 1997, Page(s):C9 - 11
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (140 KB)

    In 1994 the City of Albuquerque realized that the management of its municipal water supply was becoming a critical issue. The City commissioned studies to determine the best course of action to create a sustainable water supply through the year 2060. To meet this challenge, the City began developing the Albuquerque Water Resources Management Strategy, with a goal to reduce residential and industri... View full abstract»

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  • Deep industrial dynamics shaping next-generation semiconductor manufacturing

    Publication Year: 1997, Page(s):9 - 13
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (564 KB)

    This paper explores dynamics and sequences by which the semiconductor industry has been transformed during the past decade. It demonstrates that strategic and fab-focused cost-reduction initiatives of lead producers tell only part of the story. Equally important are the more spontaneous developments triggered by shifting cost structures throughout the industry. These developments include (a) the e... View full abstract»

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  • Construction of an energy-saving semiconductor plant

    Publication Year: 1997, Page(s):P57 - P60
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (428 KB)

    NEC Corp. has constructed an energy-saving semiconductor plant incorporating various energy-saving techniques for its electric power supply, air conditioning system, and heat source, including a cogeneration system, clean room air heating through use of waste heat from equipment cooling water, and free cleaning, in order to actively promote energy saving in semiconductor production. The new plant ... View full abstract»

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  • Application of a constraint based production line management system for semiconductor manufacturing

    Publication Year: 1997, Page(s):A41 - A44
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (380 KB)

    One of the key components of the theory of constraints is the application of the “drum-buffer-rope” principle to production line management. This involves linking the start of material into the production line with the performance of the constraint. The methodology presented in this paper uses an inventory profile system (IFS) automation tool to track the factory inventory and performa... View full abstract»

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  • Metallic contaminants generation from tubing during start-up and following moisture upsets in HCl distribution systems

    Publication Year: 1997, Page(s):P77 - P80
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (344 KB)

    Contamination control has always been an important issue for IC manufacturing processes. Within the area of corrosive gas distribution, metallic contamination is a constant threat to process yield. This paper focuses on metallic contamination resulting from low pressure HCl gas flow through tubing materials during system start-up and following exposure to moisture. The paper discusses the effect o... View full abstract»

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  • A systems approach to gate CD control: metrology, throughput, and OEE

    Publication Year: 1997, Page(s):B53 - B57
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    The 0.13 μm semiconductor manufacturing generation, shipping as early as 2001, will have transistor gate structures as small as 100 nm, creating a demand for 10 nm gate linewidth control and for measurement precision on the order of 1 nm. In this work, we show that the prospects are excellent for using CDSEM technology to control gate linewidths with 1 nm precision, very high effective throughp... View full abstract»

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