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1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)

6-8 Oct. 1997

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  • 1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)

    Publication Year: 1997
    Request permission for commercial reuse | PDF file iconPDF (462 KB)
    Freely Available from IEEE
  • Index of presenters

    Publication Year: 1997, Page(s):v - vi
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    Freely Available from IEEE
  • Adaptive sampling for effective multi-layer defect monitoring

    Publication Year: 1997, Page(s):D1 - D4
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    The main purpose of this paper is to provide an effective adaptive sampling strategy for defect monitoring in semiconductor manufacturing. The proposed sampling strategy varies the amount of sampling based on previous observations to achieve fast excursion detection or minimum yield loss due to excursions. This scheme will require the equal or less amount of inspection capacity than the traditiona... View full abstract»

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  • Advanced techniques for contact module development

    Publication Year: 1997, Page(s):P99 - 101
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (676 KB)

    We describe the application of an advanced SEM-based inspection tool (a KLA 2702 “SEMSpec”) during contact module process development. SEMSpec image contrast is derived from surface voltage variations and is particularly well suited to identifying electrical defects within contact chains. Results are presented from a study in which the SEMSpec was effectively used to identify unfilled ... View full abstract»

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  • A site wide risk assessment at Intel Corporation in New Mexico

    Publication Year: 1997, Page(s):C13 - C15
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (240 KB)

    Intel New Mexico has received intense public scrutiny since the construction of Fab 11, RR4, RR5, and the supporting Central Utilities buildings. Community concerns about routine emissions of chemicals, and the potential accidental release had been raised individually and in public forums. While Intel has historically incorporated risk assessment and risk management into facility and process desig... View full abstract»

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  • Models for estimating wear particles in preliminary design of semiconductor equipment

    Publication Year: 1997, Page(s):P45 - P48
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    There is a well recognized need for particle control and reduction, as semiconductor manufacturing is challenged by stringent device requirements. Process equipment is a significant contributor of particles. This paper focuses on the preliminary design of semiconductor equipment and illustrates the use of tribological models to understand particle generation by wear and hence make design choices t... View full abstract»

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  • Optimized in situ rinsing for HF last processes

    Publication Year: 1997, Page(s):P95 - P98
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (364 KB)

    In order to optimize HF last processing in situ rinsing is frequently discussed to avoid the transition through the air liquid interface. In this work a special tank design for high efficient rinsing post HF wafer treatment was designed, characterized by laser interferometric flow measurements and verified by studies on the etch characteristics of thermal oxide wafers in diluted hydrofluoric acid.... View full abstract»

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  • Empowering people in a five shift operation for continuous improvement

    Publication Year: 1997, Page(s):P7 - 10
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB)

    Customers demand changes, technology changes and competitive forces change. In a word, our world has become very turbulent. Remaining competitive in this turbulent environment demands a flexible and improving organization. Empowerment can make the alertness of a five shift operation higher and thereby speed up the improvement process of the organization. By training the entire workforce and formin... View full abstract»

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  • Managing overall equipment effectiveness [OEE] to optimize factory performance

    Publication Year: 1997, Page(s):A33 - A36
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    Overall equipment effectiveness (OEE) is the key metric of total productive manufacturing (TPM). OEE monitors the actual performance of a tool relative to its performance capabilities under optimal manufacturing conditions. OEE looks at the entire manufacturing environment measuring, not only the equipment availability, but also, the production efficiency while the equipment is available to run pr... View full abstract»

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  • Modeling and filtering of optical emission spectroscopy data for plasma etching systems

    Publication Year: 1997, Page(s):B41 - B44
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (380 KB)

    Full-spectrum in situ optical emission spectroscopy (OES) has emerged as a promising technology for in-line sensor systems for plasma etching process control. In this paper, we present a novel empirical model-based approach for OES data filtering based on statistical principal component analysis and jump linear filtering. The modeling procedure is demonstrated on a commercial multilayer Al/TiN/SiO... View full abstract»

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  • Sense and sensibility: the scaleable minifab

    Publication Year: 1997, Page(s):A45 - A48
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    The objective of the scaleable minifab is cost competitive, low risk IC manufacturing to satisfy a business need. This paper analyzes the capital and operating costs of a fab, and shows how the data can be used to improve the cost structures of modular IC manufacturing while containing capital risk. A modular fab can limit capital risk by allowing capacity to be added in an incremental way when ne... View full abstract»

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  • Thermal desorption behaviour of adsorbed materials on wafer surfaces

    Publication Year: 1997, Page(s):E5 - E8
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    The influence of organic contamination on dielectric breakdown of a gate oxide was evaluated. Preventing air exposure during wafer processing from gate oxidation through poly Si CVD was shown to result in lower defect densities, and results obtained with a thermal desorption spectrum-atmospheric pressure ionization mass spectrometer showed that were the source of organic contamination gases releas... View full abstract»

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  • An effective method for yield enhancement using zonal defect recognition

    Publication Year: 1997, Page(s):E25 - E28
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    This paper presents a zonal defect recognition algorithm that can be applied to the problem of automated defect recognition in semiconductor manufacturing, The algorithm uses digital image processing techniques and template matching to achieve a high recognition rate by classifying zonal defects into one of three defect types: clustered defects, gross defects, or repetitive defects. The feasibilit... View full abstract»

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  • Eliminating polymer flake defects using an oxygen free chemistry

    Publication Year: 1997, Page(s):P91 - P93
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    Catastrophic defect excursions existed in a plasma etch process due to polymer flaking. Several possible fixes such as an in-situ particle check and a Cl2 plasma clean were investigated without effectively eliminating this yield limiting defect. This paper will describe how an oxygen free chemistry was adopted to eliminate the polymer flake defect. This process change eliminated polymer... View full abstract»

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  • Real time dispatch gets real time results

    Publication Year: 1997, Page(s):P1 - P5
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    Since the on-line dispatch system is the primary method of prioritizing and directing the flow of work through a paperless fab, it makes sense that we place high demands on a dispatching tool. The demands were met by ASI's RTD system. The flexibility and customizability that RTD offers allows us to execute dispatch logic using real-time factory systems data. We can apply unique rules to accommodat... View full abstract»

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  • An advanced wet cleaning system for process integration

    Publication Year: 1997, Page(s):B13 - B16
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (332 KB)

    We developed a single wafer wet cleaning system for cluster tools available to φ 200 mm production-line, and clarified the system's advantages in terms of its ability to remove particles, suppress native oxide growth and adsorption of organic matter. Moreover, we showed that there were no water marks on the wafer treated in this system. Integration of the system and thermal processing chambers... View full abstract»

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  • SEMATECH projects in advanced process control

    Publication Year: 1997, Page(s):B25 - B28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB)

    Scatterometer measurements of critical dimensions paralleled those of atomic force microscopy down to 0.14 μm. Application of a run to run controller to chemical mechanical processes demonstrated control to target for patterned wafers and improvements in CpK of 150% for epitaxial processes. Benchmarking of commercial software for fault detection of plasma etchers demonstrated feasibility in ide... View full abstract»

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  • Improving cycle time through managing variability in a DRAM production line

    Publication Year: 1997, Page(s):A29 - A32
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (424 KB)

    The authors describe the process adopted to improve productivity in terms of cycle time decrease in a DRAM wafer fab (AMOS, Texas Instruments Italy). In order to arrange the structural and managerial factors influencing the cycle time of products, an integrated approach aimed to contain the variability is outlined. Such a process generated a 30% cycle time reduction in 1996 with a remarkable impac... View full abstract»

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  • Gate CD control for a 0.35 μm logic technology

    Publication Year: 1997, Page(s):F9 - 12
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (260 KB)

    To meet the demand for increased microprocessor performance while minimizing the loss due to excessively hot transistors, a comprehensive lithography methodology was implemented for improved gate CD control. Reduction in lot-to-lot CD variability was achieved by linking resist coaters, steppers, and developers into cells and through freezing of the process. Critical parameters were identified and ... View full abstract»

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  • Philips Semiconductors (Albuquerque site) internal water reuse system

    Publication Year: 1997, Page(s):C9 - 11
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (140 KB)

    In 1994 the City of Albuquerque realized that the management of its municipal water supply was becoming a critical issue. The City commissioned studies to determine the best course of action to create a sustainable water supply through the year 2060. To meet this challenge, the City began developing the Albuquerque Water Resources Management Strategy, with a goal to reduce residential and industri... View full abstract»

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  • Integrated process control for cluster tools using an in-line analytical module

    Publication Year: 1997, Page(s):P41 - P44
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    The paper describes a novel analytical module for in-line process control in cluster tools. Having standardized mechanical and control interfaces (SEMI MESC/CTMC), the module can be easily attached to a cluster tool and integrated into the cluster control system like a process module. Equipped with an X-ray photoelectron spectrometer, the analytical module was used for in-line control of cleaning ... View full abstract»

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  • Training time reduction in producing certified manufacturing technicians for a fabrication environment

    Publication Year: 1997, Page(s):A13 - A16
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    Intel's Fab 10 is challenged to quickly integrate new technologies into high volume manufacturing. This paper outlines how the Training Department in Fab 10 is supporting this challenge by creating new efficiencies and improvements in the delivery of Level 1 Certified Maintenance Technicians (MT) to the production floor. These efficiencies equate to a reduction of up to 30% in the Level 1 Certific... View full abstract»

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  • Wafer zone based yield analysis

    Publication Year: 1997, Page(s):E51 - E55
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (360 KB)

    The wafer fabrication process can produce both global problems that uniformly reduce the wafer probe yields and regionally distinct problems that reduce the yield of specific regions of the wafer. This paper discusses the methods used to develop simple programs capable of finding and reporting severity of low yielding wafer regions. Wafer regional yield trend graphs are explained and the comparati... View full abstract»

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  • On the utility of run to run control in semiconductor manufacturing

    Publication Year: 1997, Page(s):D9 - 12
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (376 KB)

    Run to Run (RTR) control uses data from past process runs to adjust settings for the next run. By making better use of existing in-line metrology and actuation capabilities, RTR control offers the potential of reducing variability in manufacturing with minimal capital cost. In this paper, we survey the types of equipment models that can be used for RTR control, compare existing RTR control algorit... View full abstract»

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  • Maintenance-free, high efficiency treatment system for acidic gases

    Publication Year: 1997, Page(s):P53 - P56
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    We developed a highly removal efficient wet scrubbing system for removing various acidic gases in waste gas emitted by the semiconductor and other chemical industries. Especially significant are our system's high removal efficiency (>99%) and long-term maintenance free operation View full abstract»

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