Signal Propagation on Interconnects, 2009. SPI '09. IEEE Workshop on
Date 12-15 May 2009
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Displaying Results 1 - 25 of 38
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13th IEEE Workshop on signal propagation on interconnects
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PDF (4719 KB)
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Experimental validation of the RC-interconnect effect equalization with negative group delay active circuit in planar hybrid technology
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PDF (245 KB)
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Compromised impedance match design for signal integrity of pogo pins structures with different signal-ground patterns
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PDF (968 KB)
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An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB
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PDF (778 KB)
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High frequency characterization and modeling of high density TSV in 3D integrated circuits
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PDF (294 KB)
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Signal integrity of femtosecond pulses patterns in a 500Gb/s all-optical demultiplexer for otdm interconnections by using nonlinearities in semiconductor optical amplifiers
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PDF (114 KB)
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Modeling multi-port systems from frequency response data via tangential interpolation
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PDF (201 KB)
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Passivity verification and enforcement of delayed rational function macromodels from networks characterized by tabulated data
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PDF (141 KB)
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Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections
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PDF (563 KB)
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Equivalent victim model of the coupled interconnects for simulating crosstalk induced glitches and delays
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PDF (167 KB)
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Supply voltage drop study considering on-chip self inductance of a 32-bit processor's power grid
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PDF (447 KB)
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Extraction of broadband error boxes for microprobes and recessed probe launches for measurement of printed circuit board structures
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PDF (344 KB)
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