Electronic Components and Technology Conference, 1997. Proceedings., 47th
Date 18-21 May 1997
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Displaying Results 1 - 25 of 204
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1997 Proceedings 47th Electronic Components and Technology Conference
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PDF (1023 KB)
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Author index
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PDF (405 KB)
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Optical reflective filter with comb-drive nickel micromirror for optical fiber communication
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PDF (788 KB)
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Extending the useful range of copper interconnects for high data rate signal transmission
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PDF (764 KB)
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Education and training at the Electronics Technology Laboratory of Dresden University of Technology
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PDF (608 KB)
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Process for fabricating thin film multilayer modules using photosensitive epoxy dielectrics
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PDF (604 KB)
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Revolutionary approach in tantalum capacitor design which has made microminiature 0603 case size possible and improved electrical performance
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PDF (388 KB)
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Solder bumping methods for flip chip packaging
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PDF (1368 KB)
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Next generation of electronic packaging education at Georgia Tech Packaging Research Center
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PDF (376 KB)
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Optimization for thermal and electrical performance for a flip-chip package using physical-neural network modeling
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PDF (512 KB)
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Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material
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PDF (1028 KB)
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Integration of thin film passive circuits using high/low dielectric constant materials
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PDF (652 KB)
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Problem-oriented education of electronics technology at the Technical University of Budapest
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PDF (772 KB)
