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Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Date 22-24 Oct. 2008

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Displaying Results 1 - 25 of 91
  • Main Menu

    Publication Year: 2008, Page(s): i
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  • 2008 EMAP Conference

    Publication Year: 2008, Page(s): ii
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  • 2008 EMAP Conference

    Publication Year: 2008, Page(s): 1
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  • [Copyright notice]

    Publication Year: 2008, Page(s): 2
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  • Welcome message from Shen-Li Fu, conference general chair

    Publication Year: 2008, Page(s): 3
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  • Welcome message from K. N. Chiang, conference co-chair

    Publication Year: 2008, Page(s): 4
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  • Welcome message from Yi-Jen Chan, conference co-chair

    Publication Year: 2008, Page(s): 5
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  • Welcome message from Simon Chen, conference co-chair

    Publication Year: 2008, Page(s): 6
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  • Keynote address

    Publication Year: 2008, Page(s): 7
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (218 KB)

    Provides an abstract for each of the keynote presentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings. View full abstract»

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  • Index [table of contents]

    Publication Year: 2008, Page(s):8 - 19
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  • The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF flip-chip interconnection

    Publication Year: 2008, Page(s):20 - 24
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (7243 KB) | HTML iconHTML

    In this paper, the effects of the degree of cure of an Anisotropic Conductive Film (ACF) on the material properties and the contraction stress build-up of the ACF and ACF joints stability were investigated. The degrees of cure of the ACF as a function of bonding times were quantitatively obtained by a dynamic DSC study and an Attenuated Total Reflectance/Fourier transform infrared (ATR/FT-IR) anal... View full abstract»

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  • Fluorine thermal stability of ZnO:F films investigated by thermal desorption spectroscopy

    Publication Year: 2008, Page(s):25 - 28
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1234 KB) | HTML iconHTML

    To estimate the fluorine thermal stability of fluorine doped zinc oxide (ZnO:F) films, ZnO:F films were prepared by co-sputtering zinc oxide(ZnO) and magnesium fluoride (MgF2) targets under different sputtering powers. The prepared films were tested with a thermal desorption system heated from room temperature to 500degC. Four elements: zinc (Zn), oxygen (O), magnesium (Mg) and fluorine... View full abstract»

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  • New halogen-free laminate for advanced package substrate

    Publication Year: 2008, Page(s):29 - 32
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5425 KB) | HTML iconHTML

    Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS (filler interphase control system) were applied to the mate... View full abstract»

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  • Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

    Publication Year: 2008, Page(s):33 - 36
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5036 KB) | HTML iconHTML

    In addition to a reduced Ag content, it has been demonstrated that significant improvement of drop test performance of Sn-Ag-Cu solder joints can be achieved by alloying with Mn and Ti. This study aims to investigate the effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys, as well as mechanical properties and thus to explain how the alloying el... View full abstract»

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  • Interfacial behavior between copper foil and tin upon thermal aging

    Publication Year: 2008, Page(s):37 - 40
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (8736 KB) | HTML iconHTML

    This study investigated the thermal effect on the interfacial IMC (Cu3Sn and Cu6Sn5) formation at the interface between pure tin and a copper substrate at 125degC. During thermal aging, the morphology of Cu6Sn5 transformed from a scallop to a layer shape. The thickness of IMCs (Cu3Sn, Cu6Sn5) changed with an in... View full abstract»

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  • Fatigue strength of electroplated copper thin films under uni-axial stress

    Publication Year: 2008, Page(s):41 - 44
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4154 KB) | HTML iconHTML

    Fatigue strength of electroplated copper thin films was measured under uni-axial stress. Two kinds of electroplated films were prepared for the fatigue test. One was a commercial film mainly used for interconnections in printed wiring boards. The other film was grown on a stainless steel substrate by using acid copper sulfate bath without any additive agent. The micro texture of each film was obse... View full abstract»

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  • Recent progress in copper-based wafer bonding for 3-D ICs application

    Publication Year: 2008, Page(s):45 - 48
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1538 KB) | HTML iconHTML

    This article discusses thermo-compression bonding (also known as diffusion bonding) of metallic copper and its application in 3-D stacking of ICs. Bonding process is described and characterization results are presented. A survey on recent progress of copper-based wafer bonding, particularly low temperature process, and its application for on wafer 3-D ICs are presented. View full abstract»

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  • Flexible opto-electrical interconnect module for consumer electronic application

    Publication Year: 2008, Page(s):49 - 52
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5771 KB) | HTML iconHTML

    In this paper, we performed a 4 Ch times 2.5 Gbps flexible opto-electrical interconnect module integrated with two silicon optical benchs (SiOBs), four fibers and one rigid-flexible PCB, which provided with capability of optical and electrical data transmission simultaneously. The high-speed data transmission interconnects through fiber, and the electrical transmission interconnects through the ci... View full abstract»

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  • Parameter extractions and a new calibration methodology for MOSFET sensors

    Publication Year: 2008, Page(s):53 - 56
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2479 KB) | HTML iconHTML

    In this work, we studied the availability of p-type MOSFET with 1 mum channel width and 0.15 mum channel length as a stress sensor. Under mechanical, thermal, and thermo-mechanical coupling effects, parameters of the MOSFET devices were extracted based on a new measurement methodology, and linear relationships between drain current variation and stress and/or thermal effects were obtained. Accordi... View full abstract»

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  • Low-temperature fabrication method of carbon nanotubes-based gas sensor

    Publication Year: 2008, Page(s):57 - 60
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (7646 KB) | HTML iconHTML

    Low temperature processes are the better ways to integrate carbon nanotubes (CNTs) with CMOS chips into array-type gas sensors. Almost the metal used in CMOS is Al-Si-Cu alloy, which make the sustainable temperature of CMOS structures be in the range of 400- 500degC. We offer a new fabrication method of CNTs-based gas sensors at low temperature. The oxidized silicon substrate was modified with 3-a... View full abstract»

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  • Low cost through silicon via solution suitable compatible with existing assembly infrastructure and suitable for single die and die stacked packages

    Publication Year: 2008, Page(s):61 - 64
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1154 KB) | HTML iconHTML

    In portable electronics products, where area is at a premium, there has been a move to three dimensional solutions, achieved by either package stacking or die stacking. Package stacking allows the parts to be tested before stacking to maintain high compound yields, but is volume and cost inefficient because each die has its own enclosure. Die stacking using wire bond interconnects is low cost, but... View full abstract»

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  • Optical density measurement of TFT-LCD by PMT coupled monochrome LED

    Publication Year: 2008, Page(s):65 - 68
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3909 KB) | HTML iconHTML

    A fast and innovative method using a monochromatic red LED to measure the optical density of black matrix is developed in this study. The results show that the 3-Watt monochromatic red LED performs better than that of the currently used 100-Watt halogen lamp by reducing the pumping speed by 40% and the 3-sigma standard deviation of the test samples is also superior by 40%. The measurement differen... View full abstract»

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  • Unique dry film solution for Through Silicon Via Process

    Publication Year: 2008, Page(s):69 - 71
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2401 KB) | HTML iconHTML

    ldquoThrough Silicon Via (TSV) technology has gained a lot of attention lately as a packaging solution meeting the needs for higher device performance and lower cost of ownership. The semiconductor and packaging industry is looking for new technology and alternative materials to meet the goal of true 3D integration. One of the major challenges in implementing 3D packaging is the formation of high ... View full abstract»

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  • The contact stress analysis of the ferrule-hub assembly used in the photonic device packaging

    Publication Year: 2008, Page(s):72 - 75
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2332 KB) | HTML iconHTML

    Fiber-to-the-premise architectures, by their nature, require numerous fiber connections for distribution of services to multiple home and business locations. The higher performance of angle-polished connection (APCs) in the outside plant (OSP) environment has widely used in FTTP network. The APC ferrule-hub assembly is an essential part in the device components, such as connectors and transceivers... View full abstract»

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  • Minor Fe, Co, and Ni additions to SnAgCu solders for retarding Cu3Sn growth

    Publication Year: 2008, Page(s):76 - 79
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4022 KB) | HTML iconHTML

    The solders used for this study are Sn2.5Ag0.8Cu doped with 0.03 wt.% Fe, Co, or Ni and 0, 0.005, 0.01, 0.06, or 0.1 wt.% Ni. Reaction conditions included multiple reflows for up to 10 times and solid-state aging at 160degC for up to 2000 hrs. In multiple reflow study, Cu6Sn5 was the only reaction product observed for all the different solders used. Reflows using the solder w... View full abstract»

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