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IEE Colloquium on Assembly and Connections in Microsystems (Digest No. 1997/004)

26 Feb 1997

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Displaying Results 1 - 12 of 12
  • Microsensors research at UMIST

    Publication Year: 1997, Page(s):11/1 - 11/4
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (380 KB)

    This paper reports on the activities of three research groups at UMIST pursuing work in the area of microsensors. Such work is by definition multi-disciplinary and places enormous demands on those engaged in it. This being so, it is reasonable to begin by asking the question "is it necessary to use microminiature techniques?". In presenting the examples of UMIST activities we will attempt to pose ... View full abstract»

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  • An experimental neuroprosthesis: assembly and encapsulation

    Publication Year: 1997, Page(s):10/1 - 10/2
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (136 KB)

    An increasing number of disabilities are being treated by neuroprostheses: permanent electronic implants which interact with the body. Recently, the first few British patients with neck-level spinal cord injury have received an implant which was developed in Cleveland, Ohio, to restore grasp. We have been investigating the use of implants for the restoration of leg function. In the 1980s we implan... View full abstract»

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  • High volume production of silicon sensor microsystems for automotive applications

    Publication Year: 1997, Page(s):8/1 - 8/7
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (472 KB)

    SensoNor asa is an independent company operating as an OEM-supplier located in Horten, Norway. The business idea is to develop, manufacture and market microsensors, preferably for high volume applications, based on silicon micromechanics technology. The company has a range of some standard products and offers application specific sensors such for mechanical quantities such as pressure and accelera... View full abstract»

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  • Review of conductive adhesives and inks for microengineered devices

    Publication Year: 1997, Page(s):6/1 - 6/3
    Cited by:  Papers (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (192 KB)

    The availability of high performance conductive thermoplastic adhesives offers the benefits of enhanced thermal conductivity, control of thermo-mechanical stress, and simple rework procedures in microengineered components. Versatile polymer thick film inks, having a wide range of electrical resistivities, may play a significant future role in low cost sensor packaging technology due to their compa... View full abstract»

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  • Miniaturised chemical analysis systems-materials and bonding

    Publication Year: 1997, Page(s):9/1 - 9/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (188 KB)

    Amongst the separation methods of analytical chemistry, capillary electrophoresis (CE), free-flow electrophoresis (FFE) and high performance liquid chromatography (HPLC) have been subject to a miniaturisation. These systems are called μ-TAS (miniaturised total analysis systems). Miniaturisation is the key for several advances in chemical analysis: analysis speed is drastically increased with sh... View full abstract»

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  • Low deformation and stress packaging of micro-machined devices

    Publication Year: 1997, Page(s):7/1 - 7/3
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (264 KB)

    This paper reports on low deformation packaging developed for Si chips with micro-machined elements. In particular it reports on modelling that gave design guidance on the placement of the devices on the die surface View full abstract»

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  • Assembly and interconnection of microsystems

    Publication Year: 1997, Page(s):1/1 - 1/2
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (136 KB)

    The objective of this paper is to provide an overview of technologies and materials available for Microsystems Assembly and Interconnection View full abstract»

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  • Polymer microfabrication applied to assembly and connection problems

    Publication Year: 1997, Page(s):5/1 - 5/2
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (144 KB)

    This paper will describe the wide range of polymer microfabrication techniques that are now available not only for moulding channels (and surface reliefs in general) but also for filling the reliefs with the range of materials required to produce microsystems. Examples will be described in which a polymer surface relief has been used to provide an application function, for example, a diffraction g... View full abstract»

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  • IEE Colloquium on Assembly and Connections in Microsystems (Ref. No.1997/004)

    Publication Year: 1997
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (36 KB)

    The following topics were dealt with: packaging; bonding; micro-engineering; microsensors View full abstract»

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  • Novel low expansion packages for electronics

    Publication Year: 1997, Page(s):4/1 - 4/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (212 KB)

    As part of a four year BRITE/EURAM collaborative project supported by the European Commission, GMMT is evaluating new low expansion alloys based on new aluminium-silicon duplex alloys for packages for housing semiconductor devices. The new materials are superior to packages made from competing materials in terms of weight, cost and geometrical versatility without detriment to other properties View full abstract»

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  • Packaging for microengineered devices. Lessons from the real world

    Publication Year: 1997, Page(s):2/1 - 2/8
    Cited by:  Papers (5)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (616 KB)

    This presentation reviews just a small selection of the lessons learned and experience gained in packaging small electro-mechanical devices and instruments, and suggests that many of these ideas could be relevant to the packaging and interconnection of future MEMS devices View full abstract»

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  • Flip-chip solder bonding for microsystems

    Publication Year: 1997, Page(s):3/1 - 3/3
    Cited by:  Papers (2)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (116 KB)

    Flip-chip solder bonding is a well established method for performing simultaneous interconnection and mechanical mounting of microelectronic components. It has recently been enjoying a resurgence of interest for assembly of microsystems on account of a unique process attribute, namely that the components being joined are precisely and repeatably aligned in three orthogonal directions. Sub-micron a... View full abstract»

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