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Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

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Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

Date 24-26 Sept. 2008

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Title History

Collection of papers presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems

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Workshop Committee and Programme Committee

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Preface

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Table of contents

CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone

Triangulation method for structure functions of multi-directional heat-flows

Transient dual interface measurement of the Rth-JC of power packages

Evaluation of short pulse thermal transient measurements

New approach for thermal investigation of a III – V power transistor

Ensuring temperature-insensitivity of dual-Vt designs through ITD-aware synthesis

Managing leakage power and reliability in hot chips using system floorplanning and SRAM design

Assessment of die attach quality by analysis of circuit thermal response spectrum

Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography

Compact thermal networks for conjugate heat transfer by moment matching

Block-level thermal model for floorplan stage in VLSI design flow

Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

The minimal set of parameters for exact dynamic thermal models

Automatic electro-thermal analysis in Mentor Graphics PCB Design System

Integrated thermal modeling of heterogeneous eCubes stacked devices

logical effort model extension with temperature and voltage variations

A novel procedure and device to allow comprehensive characterization of power leds over a wide range of temperature

Multi-physics analysis of a photovoltaic panel with a heat recovery system

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