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Date 8-11 Sept. 2008

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Displaying Results 1 - 25 of 139
  • [Front matter]

    Publication Year: 2008, Page(s):i - ii
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  • Table of contents

    Publication Year: 2008, Page(s):iii - xxvi
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  • Conference chair message

    Publication Year: 2008, Page(s): xxvii
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  • Technical program chair message

    Publication Year: 2008, Page(s): xxviii
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  • Technical Program Committee

    Publication Year: 2008, Page(s): xxix
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  • Keynote speaker

    Publication Year: 2008, Page(s): xxx
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (89 KB) | HTML iconHTML

    Provides an abstract for each of the keynote presentations and a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings. View full abstract»

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  • Gold level promotional partners

    Publication Year: 2008, Page(s): xxxi
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  • Silver level promotional partners

    Publication Year: 2008, Page(s): xxxii
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  • Frank McGinnis professional achievement award

    Publication Year: 2008, Page(s):xxxiii - xxxiv
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  • John Slattery Professional Achievement Award

    Publication Year: 2008, Page(s):xxxv - xxxvi
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  • AUTOTESTCON best paper awards

    Publication Year: 2008, Page(s): xxxvii
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  • AUTOTESTCON sites

    Publication Year: 2008, Page(s): xxxviii
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  • Call for papers

    Publication Year: 2008, Page(s): xxxix
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  • AUTOTESTCON board of directors

    Publication Year: 2008, Page(s): xl
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  • AUTOTESTCON 2008 sponsors

    Publication Year: 2008, Page(s): xl
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  • AUTOTESTCON 2008 committee

    Publication Year: 2008, Page(s): xli
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  • AUTOTESTCON 2008 master schedule

    Publication Year: 2008, Page(s): xlii
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  • AUTOTESTCON 2008 technical program schedule

    Publication Year: 2008, Page(s): xliii
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  • Weathering the storm: The trials and tribulations of a digital test instrument

    Publication Year: 2008, Page(s):1 - 6
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1001 KB) | HTML iconHTML

    Modern automated test equipment (ATE) is often faced with the challenge of surviving harsh conditions introduced by the user, the unit under test (UUT), and the environment. The individual channels on the ATE are often exposed to over-voltage stress conditions, over-current stress conditions, as well as high temperature operation. Many external forces can generate these extreme conditions. Unfortu... View full abstract»

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  • Automation tools for CASS and RTCASS

    Publication Year: 2008, Page(s):7 - 12
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (678 KB) | HTML iconHTML

    Transitioning from Consolidated Automated Support System (CASS) to Reconfigurable Transportable Consolidated Automated Support System (RTCASS) requires an additional set of tools that complement existing translation tools (RTCASS Toolbox and L200 Auto-Converter). The RTCASS Toolbox translates CASS Abbreviated Test Language for All Systems (ATLAS) to a format compatible with the RTCASS runtime. The... View full abstract»

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  • Airflow monitor: An effective approach to protecting assets and increasing safety in automated test equipment

    Publication Year: 2008, Page(s):13 - 16
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (821 KB) | HTML iconHTML

    Testing high power sophisticated avionics equipment requires accurate cooling airflow monitoring to protect the operator and expensive avionics equipment. This paper introduces an airflow monitor design that monitors cooling airflow, warns the operator when cooling airflow is below minimum requirements and automatically terminates testing prior to thermal failure. A method to accurately measure th... View full abstract»

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  • Use of JTAG boundary-scan for testing electronic circuit boards and systems

    Publication Year: 2008, Page(s):17 - 22
    Cited by:  Papers (3)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (507 KB) | HTML iconHTML

    Todaypsilas complex printed circuit boards and high-density ball-grid array and other chip-size package ICs have led to the standardization and wide-spread use of JTAG (Joint Test Action Group) boundary-scan technology for test and debug. Topics include the evolution of JTAG standards, basic fundamentals of boundary-scan architecture, board testability using boundary-scan and system-level testing.... View full abstract»

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  • Closed Loop Knowledge System (CLKS)

    Publication Year: 2008, Page(s):23 - 28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB) | HTML iconHTML

    This paper will provide information about the benefits of the closed loop knowledge system (CLKS). CLKS is based on a robust warehouse-based data repository and support tools where data access, storage and predictive data mining exploitation can be obtained from a web interface which will enable better decision support for war fighters. Knowledge engineering and analysis of the data required to ma... View full abstract»

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  • High-speed ADC dynamic performance validation: The impact of skew-corner lot testing

    Publication Year: 2008, Page(s):29 - 32
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (537 KB) | HTML iconHTML

    Corner-lot process statistics have been demonstrated to provide important data on component yield and functionality. In this paper, we review the basics of this statistical approach and we show how they are applied to the dynamic performance of a high-speed (800 MS/s) dual channel 6-bit ADC. The skew-corner ADC performance test results allow us to determine (a) the quality the semiconductor fabric... View full abstract»

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  • Laser Doppler vibrometry use in detecting faulty printed circuit boards

    Publication Year: 2008, Page(s):33 - 36
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (398 KB) | HTML iconHTML

    Laser Doppler vibrometry has been demonstrated to have significant potential to detect a wide range of faults in printed circuit boards and components. Large scale structural defects, such as loose or aging solder joints, will change the resonant frequency of the unit under test. The physical changes in components or PC board due to thermal overstress will also change the encapsulating material fr... View full abstract»

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