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Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Date 13-16 May 2007

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Displaying Results 1 - 25 of 75
  • 11th IEEE workshop on signal propagation on interconnects

    Publication Year: 2007 , Page(s): c1
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  • 11th IEEE workshop on signal propagation on interconnects

    Publication Year: 2007 , Page(s): i - xi
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  • Keynote speech I

    Publication Year: 2007 , Page(s): 1 - 2
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    Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings. View full abstract»

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  • Designing for energy efficient mobile platforms

    Publication Year: 2007 , Page(s): 3 - 4
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    In this presentation we overview the multi-discipline low power platform architecture and where improvements were made, we will show examples of low power innovations in process technology, microprocessor design, IO signaling and IO power delivery subsystems. We will show these innovations and techniques resulted in energy efficient mobile computing to the end user. We will end the presentation with industry trends and future challenges for low power designs. View full abstract»

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  • Session 1 on-chip interconnects I

    Publication Year: 2007 , Page(s): 5 - 6
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  • Effect of noise on timing or data-pattern dependent delay variation when transmission-line effects are taken into account for on-chip wiring

    Publication Year: 2007 , Page(s): 7 - 10
    Cited by:  Papers (3)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (4009 KB) |  | HTML iconHTML  

    The impact of data-pattern variation on timing for on-chip interconnect timing is investigated for typical local, global, and clock wiring. The validity of the methodology to combine noise and timing engines is benchmarked against accurate non-linear simulations with R(f)L(f)C circuit representation and recommendations for CAD tool development are given. View full abstract»

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  • Spice-accurate systemC macromodels of noisy on-chip communication channels

    Publication Year: 2007 , Page(s): 11 - 14
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1104 KB) |  | HTML iconHTML  

    With the advent of nanoscale technologies, even RTL and system designers must consider interconnect analysis to provide predictable performance, reliability and meet power budgets. However, system-wide modeling of high-speed interconnects using conventional circuit simulators such as SPICE can become prohibitively CPU expensive. We propose to formulate analytical interconnect macromodels capturing noise effects, and to integrate them into the SystemC communication abstractions. Experimental results show that HDL simulations achieve an average accuracy of 5% from SPICE, while a few case studies illustrate the applicability of the proposed framework for fast exploration of physical channel configuration and performance estimation. View full abstract»

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  • Equalization of interconnect propagation delay with negative group delay active circuits

    Publication Year: 2007 , Page(s): 15 - 18
    Cited by:  Papers (4)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (556 KB) |  | HTML iconHTML  

    In this paper, we propose a technique to compensate the propagation delay and losses in VLSI interconnects by using negative group delay (NGD) active circuits. This study uses the RLC models of interconnect lines currently considered in VLSI circuits. The circuit proposed here is based on a cell consisting of a Field Effect Transistor (FET) in parallel with a series RL passive network. We also describe the synthesis method to achieve simultaneousely a significant negative group delay and gain. Simulations allow us to first verify the performance of the NGD circuit and also show a restoration of the distorted signal shape as well as a reduction of propagation delay. View full abstract»

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  • Session 2 on-chip interconnects II

    Publication Year: 2007
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  • Silicon-chip single and coupled coplanar transmission line measurements and model verification up to 50GHz

    Publication Year: 2007 , Page(s): 21 - 24
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (363 KB) |  | HTML iconHTML  

    Silicon technology on-chip single and coupled coplanar transmission lines have been measured on wafer up to 50 GHz. De-embedding was performed using various methods including the L-2L technique [1,2] by measuring two transmission lines of original and double length. A novel approach has been used for the measurement of the coupled structures using conventional two port VNA. Results are investigated both in S-parameter format and in gamma-Zo format, and compared with EM solver and the parametric IBM coplanar T-line device models discussed elsewhere [3,4] which are available in IBM CMOS and SiGe technology design kits. A comparison with RC model shows the limits of RC model validity, in frequency domain. View full abstract»

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  • Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system

    Publication Year: 2007 , Page(s): 25 - 28
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1942 KB) |  | HTML iconHTML  

    Introduction of different low-K to ultra low-K dielectric material in the spacing between neighbour copper interconnects localised on the same level of metallization is analyzed. It is done to evaluate signal integrity such as crosstalk, propagation delay and rise time on a set of several unintentionally coupled Cu lines of micron and nanometer sizes. A full wave analysis based on tangential vector finite element method is implemented in MATLAB environment in order to extract, via a transmission multicoupled line model, the electrically R, L, C, G, Lm, Cm coupled elementary cell. This model with all the mutual impedance and admittance is necessary and more convenient for transient analysis by using commercial software such as Spice or other transient tool. We show that the improvement due to the introduction of low dielectric material can reach more than 200% for the crosstalk and 25% on propagation delay for 1 mm interconnect length. This work also highlights that it is not always realistic to study only a set of two or three lines because some signals appears at the far end of the second or the third interconnect located at the both sides of an attacker. View full abstract»

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  • Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects

    Publication Year: 2007 , Page(s): 29 - 32
    Cited by:  Papers (3)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (1272 KB) |  | HTML iconHTML  

    This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip. View full abstract»

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  • Session 3 transmission lines and high-speed channels I

    Publication Year: 2007 , Page(s): 33 - 34
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  • Effect of uncertainties in the cross-sectional parameters on the wideband electrical properties of coplanar waveguides

    Publication Year: 2007 , Page(s): 35 - 38
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (373 KB) |  | HTML iconHTML  

    We investigate the effect of uncertainties in the cross- sectional parameters of ungrounded coplanar waveguides (CPWs) on the characteristic impedance and the propagation constant. For our calculations, a quasi-TEM model is used that takes into consideration the effects of non-ideal conductors, substrate loss and finite metallization thickness. The propagation of uncertainties is studied with the aid of Monte Carlo (MC) simulations. The effect of different manufacturing technologies is exemplified by two typical microwave substrates (AF45 and AI2O3). Furthermore, the impact of the uncertainties in the input quantities is investigated in such a way that conclusions for the design of CPWs as well as for the requirements on the accuracy of material measurement methods can be drawn. View full abstract»

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  • Interconnect length impact investigation by measurements

    Publication Year: 2007 , Page(s): 39 - 42
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (912 KB) |  | HTML iconHTML  

    The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction. View full abstract»

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  • Session 4 macromodeling by vector fitting

    Publication Year: 2007 , Page(s): 43 - 44
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  • Broadband macromodeling of sampled frequency data using z-domain vector-fitting method

    Publication Year: 2007 , Page(s): 45 - 48
    Cited by:  Papers (5)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (495 KB) |  | HTML iconHTML  

    The vector-fitting algorithm has been used as the main macromodeling tool for approximating frequency domain responses of complex interconnects and electrical packages [Gustavsen and Semlyen, 1999]. In this paper, a new methodology is proposed to fit transfer functions of frequency response data obtained from numerical electromagnetic simulation or measured frequency-domain or time-domain response data. This new method, z-domain vector- fitting (ZDVF), is a formulation of vector-fitting method in the Z domain; it has an advantage of faster convergence and better numerical stability compared to the s-domain vector-fitting method (VF). The fast convergence of the method reduces the overall macromodel generation time. The accuracy, numerical stability and convergence speed of VF and ZDVF are compared. Examples are provided to demonstrate the advantage of the ZDVF. View full abstract»

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  • Rational modeling of multiport systems by modal vector fitting

    Publication Year: 2007 , Page(s): 49 - 52
    Cited by:  Papers (4)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (595 KB) |  | HTML iconHTML  

    This paper introduces a new approach for rational macromodeling of multiport devices that ensures high accuracy with arbitrary terminal conditions. This is achieved by reformulating the vector fitting technique to focus on eigenpairs rather than matrix elements. By choosing the least squares weighting equal to the inverse of the eigenvalue magnitude is achieved that the eigenvalues are fitted with a relative accuracy criterion. The procedure is shown to give a major improvement in accuracy for cases with a large eigenvalue spread. Also is shown how to utilize the impedance characteristics of the adjacent network in the fitting process. View full abstract»

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  • Macromodeling of transfer functions with higher-order pole multiplicities

    Publication Year: 2007 , Page(s): 53 - 56
    Cited by:  Papers (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (455 KB) |  | HTML iconHTML  

    Vector fitting is a rational approximation technique, which is frequently used to calculate accurate macromodels of electrical and electronical structures. The robustness of the technique is obtained by combining the use of a weighted iterative least squares scheme and a well-chosen partial fraction basis. It was discussed in that numerical problems may occur if poles of higher-order multiplicities are required to approximate a frequency response. This paper shows that the orthonormal vector fitting technique [3] solves this problem in a fundamental way. View full abstract»

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  • Well-conditioned adaptive interpolation by a gaussian-modulated pole kernel with applications to vector fitting

    Publication Year: 2007 , Page(s): 57 - 60
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (460 KB) |  | HTML iconHTML  

    In this contribution we discuss the translation-invariant interpolation of frequency domain functions by means of a well-conditioned Gaussian-modulated pole kernel which generates exclusively stable poles. For the implementation we use an adaptive interpolation process which is a variant of a recently introduced adaptive residual subsampling method. It is shown that the interpolation process with the Gaussian-modulated pole kernel also provides an excellent pre-processing interface when used in conjunction with the popular vector fitting algorithm. This results in a composite algorithm, performing the sampling and modelling of the given frequency function in a fully automatic way. View full abstract»

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  • Keynote speech II

    Publication Year: 2007 , Page(s): 61 - 62
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (618 KB)  

    Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings. View full abstract»

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  • Future mobile device interconnections

    Publication Year: 2007 , Page(s): 63 - 66
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (2751 KB) |  | HTML iconHTML  

    The developed concept of ultra low power multi gigabit serial interface for mobile devices removes limits from mechanical design and device architectures. Power consumption of differential line drivers were reduced to 0.8 mW by lowering common-mode voltage of signals to 200 mV and using voltage source type drivers with 50-ohm output impedance to generate +-200 mV high-speed differential signal to receiver inputs. Lowering supply voltage to 200 mV and removing the parallel termination from receiver input are possible with voltage-source type driver when output impedance is matched to line impedance, providing additional 75% power saving without any change in receiver differential input signal. Zero idle power consumption of CMOS inverters makes them ideal single-ended drivers and receivers for short control messages using the same wires as high-speed drivers when no high-speed differential signaling is required. View full abstract»

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  • Session 5 linear macromodeling I

    Publication Year: 2007 , Page(s): 67 - 68
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  • Model order reduction of large multiport interconnect structures using waveform relaxation techniques

    Publication Year: 2007 , Page(s): 69 - 70
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (329 KB) |  | HTML iconHTML  

    The large number of ports in an interconnect structure is a critical limiting factor when applying model order reduction. This is due to the fact that the size of the reduced model grows rapidly with increasing the number of ports, leading to large and dense circuit matrices. To address this problem, a new method for model order reduction based on transverse partitioning and waveform relaxation is proposed, which effectively replaces the massively coupled multiport reduced model with decoupled 2 port subcircuits. In addition to preserving the advantages of model order reduction, the computational complexity of the new method grows only linearly with the number of lines. View full abstract»

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  • Fast passivity enforcement of rational macromodels by perturbation of residue matrix eigenvalues

    Publication Year: 2007 , Page(s): 71 - 74
    Cited by:  Papers (6)  |  Patents (1)
    Save to Project icon | Click to expandQuick Abstract | PDF file iconPDF (724 KB) |  | HTML iconHTML  

    Residue perturbation (RP) is often used a means for enforcing passivity of rational models. One RP version combines a least squares problem with a constraints part and solves via quadratic programming (QP). A major difficulty is that commonly available QP solvers cannot utilize the problem sparsity, leading to lengthy computations. This paper proposes to take the eigenvalues of the residue matrices as free variables. This leads to a more compact problem and thus a fast computation (FRP). The resulting model error is found to be much smaller than when perturbing only the diagonal elements of the residue matrices. It is also shown how to combine the residue matrix eigenvalue perturbation with the recently developed modal perturbation approach (MP), leading to a fast version (FMP). The FMP/MP approaches have the additional advantage of retaining the relative accuracy of the admittance matrix eigenvalues. View full abstract»

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