Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Date 3-5 Oct. 2007
Filter Results
Displaying Results 1 - 25 of 30
-
[Front cover]
|
PDF (121 KB)
-
[Title page]
|
PDF (85 KB)
-
Copyright page
|
PDF (76 KB)
-
Foreword
|
PDF (69 KB)
-
[Advertisement]
|
PDF (636 KB)
-
Table of contents
|
PDF (112 KB)
-
Overmolded flip chip packaging solution for large die FPGA with 65nm low-k dielectrics
|
PDF (586 KB)
-
Fluxless bonding of silicon chips to ceramic packages using electroplated Au/Sn/Au structure
|
PDF (1175 KB)
-
-
-
-
-
Development and characterisation of micrometer sized polymer particles with extremely narrow size distribution
|
PDF (1054 KB)
-
-
Characterization of effective chemical shrinkage and modulus evolution during polymerization
|
PDF (273 KB)
-
-
Case study on the validation of SAC305 and SnCu-based solders in SMT, wave and hand-soldering at the contract assembler level
|
PDF (928 KB)
-
-
Eutectic liquid in Sol-Gel process for superhydrophobic silica thin films — antistiction of MEMS devices
|
PDF (2710 KB)
-
-
-
Fluxless bonding of Si chips to Ag-copper using electroplated indium and silver structures
|
PDF (1179 KB)
-
A novel Ag-Cu lamination process
|
PDF (1178 KB)
-
-
Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd conductor on low-temperature co-fired ceramic
|
PDF (1791 KB)
