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Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting

28-30 Oct 1996

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Displaying Results 1 - 25 of 71
  • Efficient transient simulation of high-speed interconnects characterized by sampled data

    Publication Year: 1996, Page(s):162 - 165
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (192 KB)

    In the past, Pade synthesis has been successfully applied to the analysis and simulation of high-speed interconnects. However, Pade synthesis (via moment-matching method) is not quite suitable for the analysis of interconnects characterized by sampled data, since the derivatives of system functions at selected expansion points are not easily obtained. This paper describes an efficient simulation m... View full abstract»

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  • Transient analysis of single interconnects characterized with measured S-parameter data

    Publication Year: 1996, Page(s):159 - 161
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (252 KB)

    The correct modeling of the transmission lines requires accurate modeling of both the frequency-dependent conductor (skin effect) and the dielectric losses. The measured S-parameter data can easily capture the behavior of these losses. The discontinuities in interconnects are difficult to describe with closed form equations. They are better characterized with the measured S-parameter data. The int... View full abstract»

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  • A general-purpose SPICE model for multiconductor transmission lines

    Publication Year: 1996, Page(s):155 - 158
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (204 KB)

    This paper presents a new model for the simulation of signal propagation in dispersive, coupled, uniform/nonuniform transmission lines using SPICE. Numerical results are used to demonstrate the validity and versatility of this new model. There are important advantages associated with the availability of a single, general transmission-line model. First and foremost, such a general model, equipped w... View full abstract»

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  • Applications of the Taguchi method for optimized package design

    Publication Year: 1996, Page(s):14 - 17
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (308 KB)

    A robust technique for noise and sensitivity analysis for packages in the system environment using the design of experiment (DOE) and orthogonal matrix array is presented. The use of DOE allows full factorial parametric analysis and the use of an orthogonal array significantly reduces the number of simulations. The results of noise and sensitivity analysis can be used to predict the noise and sens... View full abstract»

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  • CAD models of a QFP-24 pin package for radiofrequency applications

    Publication Year: 1996, Page(s):103 - 105
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    CAD models of the QFP-24 package are presented for high speed logic applications up to 1 Gbit/s and for radiofrequency applications up to 3 GHz. From geometrical parameters of the package, electromagnetic simulations are performed using an integral equations technique and lumped L-C elements are calculated, including inductive and capacitive coupling effect. Dynamic performances of an assembly inc... View full abstract»

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  • Electrical performance of integrated decoupling capacitor arrays

    Publication Year: 1996, Page(s):83 - 85
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (284 KB)

    This paper deals with assessing the electrical performance of integrated decoupling capacitor arrays, which belong to a new generation of integrated passive components (IPCs). Quasi-static numerical analysis is carried out to obtain the effective lumped capacitance and inductance values for various combinations of excitation voltages applied to the multiterminal device. Complete capacitance matric... View full abstract»

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  • Wideband 2N-port S-parameter extraction from N-port S-parameter data

    Publication Year: 1996, Page(s):150 - 152
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    A complete characterization of an N-lead package, like a QFP, is a 2N×2N matrix of parameters, but measurements on all 2N ports can be difficult. The paper presents a technique for extracting the 2N×2N matrix from multiple N-port data sets View full abstract»

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  • SSO noise electrical performance limitations for PQFP packages

    Publication Year: 1996, Page(s):117 - 119
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (212 KB)

    Factors which affect the electrical performance of PQFP packages are discussed in this paper. Limitations for PQFP package design for SSO noise are presented View full abstract»

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  • Power distribution noise suppression using transmission line termination techniques

    Publication Year: 1996, Page(s):100 - 102
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (296 KB)

    This paper presents a new formulation for the voltage distributions on radial transmission lines and a new decoupling technique to determine the optimal reactive termination of ordinary and radial transmission lines minimizing standing waves View full abstract»

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  • Electrical characterization of multi-layer BGA packages for high speed, high switching activity applications

    Publication Year: 1996, Page(s):114 - 116
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB)

    With ever-increasing requirement for package performance, multi-layer BGA packages are gradually moving into mainstream. This trend represents a major challenge in package characterization because of the difficulty in modeling the complex interaction between signal traces and power/ground planes in a multi-layer package. An accurate package model encompassing both signal and power/ground is especi... View full abstract»

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  • Thin film modeling and simulation for long off chip interconnection lines

    Publication Year: 1996, Page(s):11 - 13
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (252 KB)

    The paper describes the modeling and simulation of thin film interconnection lines with frequency dependent attenuation. It compares different modeling approaches and shows, for which lengths frequency dependency due to the large resistance is no longer negligible. Signal integrity is discussed for the coupled noise, where two horizontal neighbors are considered. The performance impact of the coup... View full abstract»

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  • Radiated emission from interconnects using transmission line approach

    Publication Year: 1996, Page(s):223 - 225
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (228 KB)

    This paper provides a detailed understanding of the radiated emission from package interconnections in the time domain. The fields radiated from a single lossless interconnect have been calculated using a transmission line approach analytically. These have been compared with the results obtained through the commonly used dipole approach for the case of matched and open load conditions. For the ass... View full abstract»

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  • Attenuation in ribbon microstrip with and without dielectric cover

    Publication Year: 1996, Page(s):97 - 99
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (176 KB)

    Losses in a microstrip on polyimide with finite metal thickness with and without dielectric cover has been modelled using variational analysis in the FTD and the data has been compared with the measurements on crosstalk View full abstract»

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  • Capacitance calculations of conical vias with thick conductors

    Publication Year: 1996, Page(s):80 - 82
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    The capacitance of circulary symmetric vias constructed from conical shaped cylinders and thick conductors are studied. Results are compared with capacitance of vias with straight cylinders and infinitely thin conductors View full abstract»

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  • Wideband impedance analysis of a grounded bondwire buried in epoxy molding compounds

    Publication Year: 1996, Page(s):55 - 57
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (176 KB)

    The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials have been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The input impedance of a grounded bondwire in FR-4 composites is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies View full abstract»

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  • Development of a surface mountable plastic package characterization technique

    Publication Year: 1996, Page(s):147 - 149
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (204 KB)

    We present a method to characterize surface mountable plastic packages and packaged chips. A novel thin-film alumina substrate has been developed to mount plastic packages. The substrate establishes RF interconnections from plastic packages to coplanar waveguide (CPW) microprobes via CPW to package adapters (CPA). CPA calibration standards were fabricated based on the LRM error correction techniqu... View full abstract»

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  • Comparison of differential and common mode response for short transmission line using PEEC models

    Publication Year: 1996, Page(s):169 - 171
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (160 KB)

    In this paper the common and differential mode responses are compared for three different circuit models for a short transmission line to a fast rising input signal. The three models are the conventional method of characteristics model, a (Lp,P)PEEC model without delays as well as a (Lp,P,τ)PEEC model with delays. All three models give reasonable responses for the differe... View full abstract»

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  • Alpha chip packaging challenges of today and tomorrow

    Publication Year: 1996
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (36 KB)

    Summary form only given, as follows. Several generations of Alpha microprocessors have been designed and delivered which have provided industry leading performance. Chip and packaging design for Alpha have worked collaboratively to allow optimization across both spaces to ship at the highest chip performance and lowest packaging cost. The authors review the packaging design methods and technologie... View full abstract»

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  • Delta-I modeling approximation for single chip modules

    Publication Year: 1996, Page(s):111 - 113
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (232 KB)

    In this paper the impact of the inductance path on the power plane of a representative single chip module for cost performance machines is quantified via loop inductance comparison and Delta-I noise simulations. In addition the impact of the inclusion of the via to pin mutual is investigated. Finally, a simplified model based on two dimensional analysis of the via and pin structure is compared wit... View full abstract»

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  • Low-profile integrated antennas for mobile radio communications

    Publication Year: 1996, Page(s):176 - 178
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (288 KB)

    This paper focuses on the development and characterization of low-profile and integrated antennas with enhanced bandwidth for mobile communications applications. Novel radiator configurations are studied by adding parasitic or tuning elements to some well-characterized integrated antennas View full abstract»

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  • Electrical Performance of Electronic Packaging

    Publication Year: 1996
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The Conference provides a forum for the presentation and discussion of the latest advances in electrical design, analysis and characterization of interconnections and packaging structures for digital, mixed signal, RF, microwave and mm-wave applications. The following topics were dealt with: system packaging trends; package design issues; microprocessor packaging design; on-chip interconnection is... View full abstract»

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  • Minimum segmentation in the surface ribbon method for series impedance calculations of microstrip lines

    Publication Year: 1996, Page(s):232 - 235
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (264 KB)

    The efficiency and accuracy of the surface ribbon method has been shown in calculating frequency-dependent resistance and inductance. In this paper, the further numerical efficiency is obtained by deriving a minimum segmentation scheme for microstrip lines, without loss in accuracy View full abstract»

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  • On the parallelization of geometry independent-measured equation of invariance

    Publication Year: 1996, Page(s):61 - 63
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (228 KB)

    The Geometry Independent Measured Equation of Invariance (GIMEI), which has been recently proposed to analyse IC interconnect and packages, enhances the original measured Equation of Invariance (MEI) substantially and has been demonstrated to be an order of magnitude faster than FASTCAP. Due to the nature of MEI and Finite Difference (FD), GIMEI is perfect for parallel computation and has very lit... View full abstract»

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  • Accurate, high speed modeling of integrated passive devices in multichip modules

    Publication Year: 1996, Page(s):184 - 186
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB)

    A new method for the predictive modeling of passive devices with interactions based upon measurement and primitive cell characterization is presented. Building block RLC equivalents can be utilized for arbitrary geometry device modeling in high speed circuit simulators View full abstract»

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  • Analysis of crosstalk in packaged microwave circuits

    Publication Year: 1996, Page(s):193 - 195
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (188 KB)

    Crosstalk in a packaged multi-circuit system is simulated by applying the FDTD method using large-signal analysis. The capability of full-wave simulation is obtained by appropriate modeling of the device-wave interaction. Crosstalk of different input-power levels, thus, is examined by checking the output power View full abstract»

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