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2006 29th International Spring Seminar on Electronics Technology

Date 10-14 May 2006

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Displaying Results 1 - 25 of 111
  • [Front cover]

    Publication Year: 2006, Page(s): C1
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  • [Title page]

    Publication Year: 2006, Page(s): C2
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  • [Copyright notice]

    Publication Year: 2006
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  • Contents

    Publication Year: 2006, Page(s): 3
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  • Conference Committees

    Publication Year: 2006, Page(s): 4
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  • Preface

    Publication Year: 2006, Page(s): 5
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  • General Information

    Publication Year: 2006, Page(s): 6
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  • Paper Overview

    Publication Year: 2006, Page(s):7 - 13
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  • Applications and Comparison of Failure Analysis Methods

    Publication Year: 2006, Page(s):14 - 19
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (909 KB) | HTML iconHTML

    As the importance of quality insurance and reliability is increasing electronic manufacturers apply more and more failure detection and analysis methods in and off the production line. The aim of this paper is to describe and compare the applicability of several up-to-date failure analysis methods. The discussed techniques are X-ray microstructure analysis, SAM (scanning acoustic microscopy), SEM ... View full abstract»

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  • Material characterization of substrates for power modules

    Publication Year: 2006, Page(s):20 - 25
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (625 KB) | HTML iconHTML

    Lifetime predictions of mounted components and solder joints are established. Usually the effect of solder degeneration is described. However, in power modules solder junctions are not the only locations where damage occurs. In particular, ceramic substrates can also develop fractures and connections to heat sinks can be destroyed. In an attempt to consider this effect for lifetime predictions on ... View full abstract»

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  • Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints

    Publication Year: 2006, Page(s):26 - 31
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB) | HTML iconHTML

    This paper presents the results of thermo-mechanical lifetime tests. A novel test vehicle was employed to characterize solder joint reliability of miniaturized lead-free tin-silver-copper solder bumps. The test vehicle consists of a stiff ceramic chip (AI2O3) with four corner solder joints assembled on a FR-4 PWB. The distance between the solder joint centers is variable (d= ... View full abstract»

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  • Solidification Behavior of Lead-Free SnAgCu Alloys

    Publication Year: 2006, Page(s):32 - 37
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2937 KB) | HTML iconHTML

    The paper reports about influences of cooling rate, alloy composition and thermal storage on the microstructure of Lead-Free SnAgCu alloys. Three different SnAgCu solders were solidified with rates from 0.35 K/min to 37.4 K/min. The microstructure of these bulk specimens show that size and number of intermetallics depend on solidification conditions. The influence of solder composition was investi... View full abstract»

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  • Methodology for Manufacturing Improvement

    Publication Year: 2006, Page(s):38 - 43
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB) | HTML iconHTML

    The paper deals with the new CQT methodology approach to the improvement of the process control in printed circuit board (PCB) manufacturing. The CQT methodology is based on the application of the selected methods and tools. The applied methods cover two key areas. The first area contains methods for description and modelling of processes. The second area contains methods for optimizing of process... View full abstract»

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  • Low Temperature non-viscous adhesive bonding in MEMS

    Publication Year: 2006, Page(s):44 - 48
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (337 KB) | HTML iconHTML

    This paper discusses various aspects of the design, the realisation and the testing of an bonding technique for assembly of micro(optoelectronic) systems. The proposed concept of non-viscous adhesives micro bonding overcomes the main disadvantages of the traditional MEMS bonding processes like requirements for high voltage, high temperature, high quality of surfaces, etc. Experiments were performe... View full abstract»

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  • Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications

    Publication Year: 2006, Page(s):49 - 54
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (310 KB) | HTML iconHTML

    Heat removal from power SMDs in a D2PAK package for high temperature applications is investigated. The components are mounted on a glass fiber reinforced (FR4) printed circuit board (PCB) by soldering whereby the solder pad for the D2PAK is realized as array of "thermal vias "for an improved conduction of the power loss from the component side to the bottom side of the PCB. A... View full abstract»

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  • Realization of μ-Vias in LTCC Tape

    Publication Year: 2006, Page(s):55 - 63
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1531 KB) | HTML iconHTML

    Today LTCC (Low Temperature Co-fired Ceramics) Technology is established as a key technology for ceramic based interconnects on modules and components. Known for their excellent thermal and high frequency electrical performance, LTCC Technology is gaining new applications e.g. in the automotive and telecommunications market. Over the last years, LTCC materials and production processes have been fu... View full abstract»

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  • Dielectric properties of e-gun evaporated LiNbO3 thin films

    Publication Year: 2006, Page(s):64 - 67
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (199 KB) | HTML iconHTML

    Lithium niobate, LiNbO3, thin films are mostly known for their technological applications in electrochromic displays or in all solid state thin film microbatteries. Various methods have been used for preparation of LiNbO3 thin films. Lithium niobate was prepared as a thin film layered structure using e-gun evaporation for this study. Metallic films of Li between two Li-Nb-O l... View full abstract»

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  • Ceramic Interposer for Optoelectronic Array Devices

    Publication Year: 2006, Page(s):68 - 73
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (830 KB) | HTML iconHTML

    The paper presents the design, fabrication process and characterization of novel ceramic carrier package for parallel optical transmitter/receiver multi-chip module (MCM) are presented. The module integrates function of electrical-to-optical signal conversion (and back again) and the optical in and out-coupling into the PCB-integrated waveguides. Assumed solder-bumped flip chip bonding technology ... View full abstract»

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  • Test of glass electrical solidity for high - temperature protective layers

    Publication Year: 2006, Page(s):74 - 79
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (841 KB) | HTML iconHTML

    Glass is the most used high-temperature protective layer in electronics and microelectronics. Reliability of the devices extremely depends on glass compactness and solidity. In this paper we present a test method for controlling glass solidity and compactness. In this case glass is protective layer for high-temperature sensor in automotive applications. The test method includes protective glass la... View full abstract»

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  • Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens

    Publication Year: 2006, Page(s):80 - 85
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (329 KB) | HTML iconHTML

    The investigation of the forced convection heating efficiency in reflow soldering environment and its necessity was presented in our paper. The calculations are based on the mass stream changes on the surface of the circuit, which have high impact on the convection constant. But all important stream variables (scalar space of the density, vector space of the speed, rotation etc.) were studied. The... View full abstract»

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  • Lead-Free Soldering Technology Review - Evaluating Solder Pastes and Stencils

    Publication Year: 2006, Page(s):86 - 91
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1049 KB) | HTML iconHTML

    Lead-free solders differ from lead-bearing solders in several properties such as surface tension, wetting ability, etc. In paste form they have greater adhesion force, so they can block small stencil apertures more easily. Because of this fact, the printing parameters and stencils design criterias have to be changed. Since lead-free soldering has to be implemented in the electronic industry until ... View full abstract»

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  • Direct Digital Frequency Synthesis implemented on a FPGA chip

    Publication Year: 2006, Page(s):92 - 97
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (491 KB) | HTML iconHTML

    In applications where very precisely frequencies and fast switching speed are required the best solution consists in a DDFS circuit. This solution is very attractive in all digital systems because this architecture can provide fast tuning speed and coherent phase. In this paper a direct digital frequency synthesizer implemented on a FPGA (field programmable gate array) chip is presented. Comparati... View full abstract»

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  • Quality of PCB Interconnections Based on Blind Microvias Metallized by Magnetron Sputtering Deposition

    Publication Year: 2006, Page(s):98 - 102
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1392 KB) | HTML iconHTML

    The magnetron sputtering deposition process to metallize the high aspect ratio (deep/diameter) blind microvias was used. In this technique it is innovative that magnetron sputtering deposition process can be used with self-sustaining mode. This mode allows to deposit of very clear (without any labour gas particles) electro-conductive layers (Radzimski et al., 1998). Typically, the thickness of dep... View full abstract»

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  • Electrical Properties of Low Temperature Cofired Ceramics with Integrated Bulk Metals

    Publication Year: 2006, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (531 KB) | HTML iconHTML

    Constrained sintering allows the cofired integration of bulk metals in LTCC (low temperature cofired ceramics) instead of paste prints. A difficulty of such an integration is the application of the metallic structures on the sensitive unfired ceramic foils. The paper shows different techniques for solving this problem. Higher possible resolution and more precise edges are the advantages of bulk me... View full abstract»

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  • Design of telemetry platform system for biomedical pressure monitoring

    Publication Year: 2006, Page(s):109 - 114
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (350 KB) | HTML iconHTML

    The main goal of this work is to fabricate a miniaturized, low power, bi-directional wireless communication system that can be used for in vivo pressure monitoring. The system prototype consists of miniature FSK transceiver integrated with Microcontroller unit (MCU) in one small package, chip antenna, and capacitive interface circuitry based on Delta-sigma (SigmaDelta) modulator. At the base stati... View full abstract»

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