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Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Date 2-4 Oct. 1995

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Displaying Results 1 - 25 of 86
  • Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

    Publication Year: 1995
    Request permission for commercial reuse | PDF file iconPDF (456 KB)
    Freely Available from IEEE
  • Author index

    Publication Year: 1995
    Request permission for commercial reuse | PDF file iconPDF (145 KB)
    Freely Available from IEEE
  • Ericsson's VLSI mini-fab strategy; low volume VLSI fab to ensure short time to market for Ericsson telecom systems and products

    Publication Year: 1995, Page(s):482 - 485
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1040 KB)

    Ericsson adopted a rather different approach when it planned a submicron fab at its Kista site in Sweden. Wafer manufacturing volumes were less important than time factors, since the principal role of the fab is to reduce the design and manufacturing lead times for the complex ASICs needed in the company's telecommunications products and systems. In this paper, the author describes Ericsson's rath... View full abstract»

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  • Single-wafer processing: opportunities and challenges

    Publication Year: 1995, Page(s):480 - 481
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (176 KB)

    As we approach the 0.25-μm technology node and 300-mm wafer manufacturing, the industry is challenged to develop new thermal processing tools to replace traditional large-batch furnaces. The most technically challenging process for practical single-wafer implementation is thick oxidation (e.g., for device isolation). In general, the tradeoff between process uniformity, yield and throughput, for... View full abstract»

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  • Impact of minienvironments on facilities cost

    Publication Year: 1995, Page(s):286 - 291
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    The Strategic Future Fab Study considered minienvironments as an alternative to more traditional “ballroom” full filter ceiling design configurations. The study determined that there were real cost savings associated with implementing minienvironment use. Tangible savings in the area of HVAC equipment first cost, ongoing energy cost reduction, and clean room garment cost saving, were i... View full abstract»

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  • Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques

    Publication Year: 1995, Page(s):471 - 479
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1008 KB)

    Focuses on developing a manufacturable, robust, ion implanted 0.6 μm GaAs metal-semiconductor field-effect transistor (MESFET) and metal-semiconductor-metal (MSM) based optoelectronic integrated circuit process. Our approach is to represent the OEIC process as the integration of key process modules. Each process module has well defined design parameters and statistically significant transfer ch... View full abstract»

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  • Product integrity assessment using fatigue synthesis for avionics programs

    Publication Year: 1995, Page(s):133 - 140
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1208 KB)

    The thermo-mechanical integrity of an electronics assembly is strongly affected by the attachment method used between functional components and the printed wiring board. The use of solder as an interconnect medium is the most common method in use today. In most applications, solder is required to serve multiple functions including electrical, thermal, and structural connection. Repetitive loads ca... View full abstract»

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  • Development of ultra-fine pitch ball bonding technology

    Publication Year: 1995, Page(s):295 - 298
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1016 KB)

    While the environment surrounding wire bonding, i.e., wire, lead frame, wire bonder, and capillary, is being developed more eagerly than ever, wire bonding technology which can better meet the more compact and higher density chips without modifying the existing assembly process is desired. This paper discusses reduction of the diameter of a ball to be formed at the tip of the wire, the required wi... View full abstract»

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  • An overview of manufacturing BGA technology

    Publication Year: 1995, Page(s):434 - 437
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (624 KB)

    Ball Grid Array (BGA) technology is one ofthe leading edge technologies in surface mount manufacturing. The driving force behind the advancement of BGA technology is the lead spacing of standard surface mount devices. As lead pitches drop below 20 mil, manufacturing becomes exponentially more difficult. BGA technology provides the same I/O count in the same body size with a significant increase in... View full abstract»

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  • Electrical and mechanical studies of MCM-D interconnect structure

    Publication Year: 1995, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    The electrical and mechanical properties of a multilayer thin-film MCM-D interconnect are studied in this investigation. Numerical analyses are executed to calculate the electrical parameters of thin-film microstrip line and it shows that the additional delay decreases while increasing the thickness of the conductor. Environmental scanning electron microscopy (E-SEM) was utilized to characterize m... View full abstract»

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  • The resin molded chip size package (MCSP)

    Publication Year: 1995, Page(s):410 - 415
    Cited by:  Papers (2)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    The resin molded chip size package (MCSP), consisting of a polyimide/Cu film carrier with metal bumps, has been developed. The CSP having area-array type electrodes connected with the printed circuit board has been developed by many semiconductor companies. We have developed a resin molded CSP. The encapsulant used for this application has also been developed; it is unlike the conventional liquid ... View full abstract»

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  • Design of future single wafer logic fabs

    Publication Year: 1995, Page(s):283 - 285
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    Describes several unique, single wafer, logic fabs designed to meet the challenges of wafer processing in the 1990s. Specifically, the author compares four fab designs: (1) a new fab standard (NFS), which is designed with minienvironment Class 1 or better in the wafer processing and Class 10,000 in the support areas; (2) a more conventional Class 1 ball-room design that is smaller due to new tooli... View full abstract»

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  • Properties of thin layers of Sn62Pb36Ag2

    Publication Year: 1995, Page(s):502 - 507
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1104 KB)

    The increasing miniaturisation of surface mount devices(SMD) reveals some new questions concerning the reliability of solder joints. The components become larger and the solder joints smaller. Especially the thickness mainly influences the mean lifetime of surface mount technology (SMT) solder joints, where micro-fracture and damage evolve under thermomechanical cycling. When the electrical power ... View full abstract»

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  • Distributed control of hot bar thermode in fine pitch surface mount assembly

    Publication Year: 1995, Page(s):318 - 323
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    A hot bar thermode is viewed as a process with spatially distributed controlled variable (temperature) and disturbance (thermal load). A transfer matrix model, describing thermal inertia and heat propagation in the thermode, is defined and the model parameters are experimentally estimated. This model, implemented in software, is used to evaluate various control techniques: the existing single-inpu... View full abstract»

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  • Issues in low-cost manufacture of reliable optoelectronic systems

    Publication Year: 1995, Page(s):460 - 470
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    A product with high assembly efficiency will, in general, have a low defect count. So, it may be expected that the application of DFA would improve the reliability of optoelectronic systems. Nevertheless, detailed reliability assessment of the product is necessary during the product design and development phase either to compare alternate designs or to assess potential reliability problems in a ca... View full abstract»

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  • Dual chip memory package

    Publication Year: 1995, Page(s):127 - 132
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    Today's computer systems require more main memories than before due to the development of heavy-load softwares and the integration of multiple functions in a computer. However, since the computers became portable the sizes of computers are getting smaller. This means that it is necessary to put more memory chips into a limited space of the computers. In order to fulfil above requirement, a new hig... View full abstract»

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  • Production improvements using a forward scheduler

    Publication Year: 1995, Page(s):205 - 209
    Cited by:  Patents (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    One of the fabricators at the IBM Microelectronics Division's manufacturing facility in Essex Junction, Vermont, is a high volume producer of DRAM's and advanced logic products. The wafer processing line is controlled by several custom software systems distributed over multiple mainframe host computers. The IBM Forward Scheduler used in this fabricator is a product scheduling system that provides ... View full abstract»

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  • Optimization of solder paste printability with laser inspection technique

    Publication Year: 1995, Page(s):361 - 365
    Cited by:  Papers (8)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (504 KB)

    This paper describes an evaluation technique for solder paste printability using a solder paste inspection system and optimization of printing parameters. In a Surface Mount Assembly (SMA), it is very important to evaluate printability of solder paste precisely, because printability of solder paste directly influences reflow soldering quality. We established quite reliable inspection criteria for ... View full abstract»

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  • Utilizing production data to increase factory capacity

    Publication Year: 1995, Page(s):292 - 294
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (336 KB)

    The amount of data that is captured by any semiconductor manufacturing shop floor control system is massive. Unfortunately, much of the production data that is collected is rarely used. One way to determine a factory's capacity is to determine the capacity of the factory's bottleneck tools. If the capacity of the bottleneck tools can be increased, then the factory's capacity will also increase. Th... View full abstract»

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  • Reusable modeling capabilities for simulating high volume electronics manufacturing systems

    Publication Year: 1995, Page(s):179 - 186
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    This paper introduces modeling tools, developed in conjunction with personnel at Chrysler's Huntsville Electronics Division (HED), for the rapid modeling and analysis of high volume electronics production lines. The tools that are discussed include a Windows-based line definition program and static capacity evaluator with proposed links to a custom simulation package as well as the increasingly po... View full abstract»

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  • Reliability of soldered silicon devices on copper alloys

    Publication Year: 1995, Page(s):148 - 157
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5952 KB)

    Functional reliability of power ICs is dependent on the integrity of IC/heat transfer joint area. Any major reactions during soldering on the heat-spreader and transport of reaction products to the silicon/metal interface have an adverse effect on the IC performance. The robustness of silicon backside metallization and the selection of metallization scheme can prevent the solder reactions at the s... View full abstract»

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  • Mounting technology of BGA-P and BGA-T

    Publication Year: 1995, Page(s):417 - 421
    Cited by:  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (712 KB)

    The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test... View full abstract»

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  • Nitrogen reflow ovens: the effect exit temperature has on benzotriazole coated copper boards

    Publication Year: 1995, Page(s):329 - 336
    Cited by:  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    Reports on the comparisons made of three nitrogen capable ovens. The ovens range in size and price representative of common market offerings. The ovens compared were forced convection type and oxygen concentrations (02 ppm) were set at comparable levels. All of the ovens have some exit cooling capability (nitrogen contained). Cards exiting the oven may be oxidized to different levels, dependent on... View full abstract»

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  • Underfill flow as viscous flow between parallel plates driven by capillary action

    Publication Year: 1995, Page(s):8 - 13
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    Epoxy underfill is often required to enhance the reliability of flip-chip interconnects. This study evaluates the flow of filled epoxy underfill materials between parallel plates driven by capillary action. An exact model was developed to understand the functional relationship between flow distance, flow time, separation distance, surface tension, and viscosity for quasi-steady laminar flow betwee... View full abstract»

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  • Advanced interconnect and low cost μ stud BGA

    Publication Year: 1995, Page(s):428 - 433
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (712 KB)

    The μ stud BGA is designed to reduce the number of interconnects for higher reliability and low cost. The manufacturing processes of conventional lead-frame are applied to make a high pin count package. Numerous studs are laid out around the LSI's pad area in 0.5 mm pitch for wire bonding. The bottoms of the studs are directly connected to the substrate by micro-soldering. The μ stud BGA has... View full abstract»

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