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Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

18-20 March 1992

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  • Proceedings. 1992 IEEE Multi-Chip Module Conference MCMC-92 (Cat. No.92CH3124-5)

    Publication Year: 1992
    Request permission for commercial reuse | PDF file iconPDF (32 KB)
    Freely Available from IEEE
  • High-performance MCM interconnection circuits and fluxoelectronics

    Publication Year: 1992, Page(s):175 - 178
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    The authors describe the benefits of air-dielectric interconnections and fluxoelectronic interconnection circuits in high-performance multichip modules (MCMS). Not only do superconductors provide low-loss, dispersionless interconnection, but they also provide low-power, high-speed alternatives to conventional interconnection circuits. The low current levels in fluxoelectronic methods and low-volta... View full abstract»

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  • Silicon-on-silicon MCMs with integrated passive components

    Publication Year: 1992, Page(s):155 - 158
    Cited by:  Papers (35)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    The authors evaluate a prototype silicon-on-silicon multichip module for potential use in cost-driven applications. The incorporation of integrated passive components, resistors and capacitors, in the module substrate is a significant advantage in many of these kinds of applications. A module has been built that incorporates both linear and bipolar and digital CMOS circuits. The unique features of... View full abstract»

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  • An overlay interconnect technology for 1 GHz and above MCMs

    Publication Year: 1992, Page(s):171 - 174
    Cited by:  Papers (3)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    An overlay interconnect technology is presented that is suitable for 1 GHz and above operation of GaAs and Si multichip module (MCM) circuits. This technology encompasses a back side bonded, chips first approach with an adaptive laser photolithography defined multilayer overlay interconnect providing consistent line impedances with low crosstalk and signal delay. Signal propagation velocities of 1... View full abstract»

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  • Optical interfaces for multichip modules

    Publication Year: 1992, Page(s):150 - 153
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    An approach to an interconnection scheme for multichip modules (MCMs) based on the use of single-mode optical fiber and long-wavelength (1.3 μm) semiconductor diode lasers is described. The author considers some of the requirements of a fiber-based interconnection scheme applicable to MCM technology. For MCM interconnection work, many mechanical alignments and materials interfaces can be elimin... View full abstract»

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  • Applications of multichip modules for high speed communications interfaces

    Publication Year: 1992, Page(s):16 - 18
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (196 KB)

    The analysis of next generation broadband communication equipment shows that advanced packaging technology is required to meet system performance, thermal and density requirements. A description of a broadband crossconnect switching system is provided, and the use of multichip module technology to satisfy the system packaging requirements is reviewed. A module solution to one of the key elements o... View full abstract»

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  • IBM ES/9000 buried engineering change modeling for verification [MCM]

    Publication Year: 1992, Page(s):167 - 170
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    Buried engineering change (BEC) is a method of laying out engineering change (EC) wires within a multichip module (MCM) at the original building time for later use. The authors discuss the modeling used to accurately predict delay, validate electrical integrity, and add a degree of flexibility to the wiring process. The purpose of developing this BEC modeling methodology was to provide fast, accur... View full abstract»

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  • On the study of skin-effect and dispersion of heavily lossy transmission lines

    Publication Year: 1992, Page(s):60 - 63
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (172 KB)

    A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison rev... View full abstract»

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  • A high-speed multi-dielectric capacitance-extraction algorithm for MCM interconnects

    Publication Year: 1992, Page(s):86 - 89
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB)

    The authors report an extension of a stochastic algorithm for capacitance extraction in complex two- and three-dimensional multidielectric structures. The algorithm has applications in the area of circuit modeling of multichip modules. The extension is in the form of a simple probability rule that depends on the ratio of electric permittivities across dielectric interfaces. Computational results a... View full abstract»

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  • Fully integrated silicon based optical motherboards

    Publication Year: 1992, Page(s):146 - 149
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (276 KB)

    Optical-fiber-based telecommunications networks require the use of complex optical systems involving semiconductor lasers, detectors, fiber amplifiers, waveguides, and control electronics. A silicon motherboard process technology is described which enables the full range of components to be fabricated on the motherboard (waveguides), mounted on the motherboard (lasers and detectors), or connected ... View full abstract»

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  • Analysis of MCMs using asymptotic waveform evaluation (AWE)

    Publication Year: 1992, Page(s):48 - 51
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (284 KB)

    Asymptotic waveform evaluation (AWE) is a new method of efficiently analyzing linear circuits. The authors illustrate the applicability of AWE to the analysis of multichip module (MCM) interconnect structures from chip level through packaging, through thick or thin film interconnect and back again. The algorithm is described. Many extensions have been made to the AWE algorithm to render it more su... View full abstract»

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  • System partitioning for multi-chip modules under timing and capacity constraints

    Publication Year: 1992, Page(s):123 - 126
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (348 KB)

    The authors propose an efficient and effective algorithm for system partitioning under timing and capacity constraints. They consider the problem of assigning functional blocks into slots on multi-chip modules in high-level design to have fast feedback on the impact of high-level design decisions. A clustering step is used to ensure timing correctness, followed by packing and the K&L algorithm... View full abstract»

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  • Perspectives on multi-chip modules: substrate alternatives

    Publication Year: 1992, Page(s):12 - 15
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (420 KB)

    A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded u... View full abstract»

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  • Rapid prototyping of multi-chip modules

    Publication Year: 1992, Page(s):163 - 166
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (368 KB)

    The authors describe a rapid prototyping methodology for multichip modules, based upon laser processes for linking and cutting conductors. They discuss some of the design and test issues involved in this approach. Results are presented of efforts to independently demonstrate each component technology View full abstract»

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  • Bare die test

    Publication Year: 1992, Page(s):24 - 27
    Cited by:  Papers (23)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The author describes a bare die test approach that uses a temporary interconnect technique overlaid on a reconstructed pseudo-wafer of individual bare dice. This overlay technique maps design-specific pad locations to a standard grid that can be tested with a universal membrane probe. The proposed approach allows the development cost of a thin-film membrane probe to be shared across many die types... View full abstract»

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  • Yield modeling of MCM assembly with flip-chip thermocompression bondings

    Publication Year: 1992, Page(s):68 - 71
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (224 KB)

    Flip-chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. A yield model has been developed for flip-chip, thermocompression bondings. The model predicts the assembly yield as a function of forces and planarities of the end effector, bump height variations, bump geometries, mechanical properties corre... View full abstract»

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  • The reliability performance evaluation of high-density thin-film multichip substrates

    Publication Year: 1992, Page(s):94 - 97
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (288 KB)

    For the DEC VAX-9000 computer, a high-density interconnect called the high density signal carrier was developed. The author describes the reliability performance evaluation of the high density signal carrier through the phases of the program from the early reliability prediction, through the subsequent reliability assessment and debugging and ongoing reliability testing, to the later analysis of t... View full abstract»

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  • Simulation and optimization of interconnect delay and crosstalk in multi-chip modules

    Publication Year: 1992, Page(s):56 - 59
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (224 KB)

    As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques acc... View full abstract»

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  • Thermal management for ceramic multichip modules: experimental program

    Publication Year: 1992, Page(s):75 - 78
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    The author describes the thermal characterization of an alumina-tungsten multilayer multichip module (MCM). A five-chip cavity-down MCM was designed to represent a typical substrate product. Thermal test multichip modules were assembled and the thermal performance quantified for both the internal and the external thermal resistances. The die junction-to-ambient resistance was measured in forced-ai... View full abstract»

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  • Full wave electrical modeling of MCM by robust design methodology

    Publication Year: 1992, Page(s):83 - 85
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (200 KB)

    The author describes the modeling of a glass ceramic multichip module (MCM) by using statistical design techniques. The electrical design of the MCM was achieved by a robust design technique using a full-wave electromagnetic solver. The design point was determined by modeling a five-level fractional factorial matrix covering the full range of the process capabilities. The design point yielded a 50... View full abstract»

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  • High-density, array, optical interconnects for multi-chip modules

    Publication Year: 1992, Page(s):142 - 145
    Cited by:  Papers (3)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (200 KB)

    A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The optoelectronic module contains both a four-channel AlGaAs laser transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver on a single substrate. The optical waveguides act as an optical bench which mechanically aligns the optoelectronic components, waveguides, and off-... View full abstract»

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  • Boundary-scan test structures and test-bench compilation in a multichip module synthesis system

    Publication Year: 1992, Page(s):44 - 47
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (232 KB)

    The authors present a testing methodology for multichip module (MCM) designs, which were automatically generated by a behavioral synthesis system. The testability of the design was enhanced by automatic insertion of boundary scan architecture in every chip of the MCM design. The test vectors for the synthesized design were automatically derived from the behavioral test vectors, which were used to ... View full abstract»

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  • Peripheral circuit design for field programmable MCM systems

    Publication Year: 1992, Page(s):119 - 122
    Cited by:  Papers (8)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (300 KB)

    A field programmable multichip module (MCM) architecture utilizing an array of modified field-programmable gate arrays (FPGAs) is proposed. Interconnections are provided by a fixed wiring network on the MCM, and by programmable interconnection frames on each FPGA. It is shown that full-swing CMOS peripheral circuits are faster than low-swing CMOS circuits. Buffering configurations for the intercon... View full abstract»

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  • Performance modeling of a cache system with three interconnect technologies: cyanate ester PCB, chip-on-board and Cu/PI MCM

    Publication Year: 1992, Page(s):134 - 137, 179
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (380 KB)

    To understand the tradeoffs in different interconnect technologies, and to investigate the applicability of MCM (multi-chip module) technology to high performance computer products, an electrical performance modeling study on a cache system using three interconnect technologies was conducted. The three technologies were a high density cyanate ester PCB; chip-on-board; and a copper/polyimide MCM wi... View full abstract»

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  • MCM prototyping using overlay interconnect process

    Publication Year: 1992, Page(s):36 - 39
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (268 KB)

    The construction of complex multichip modules requires a means of evaluating the prototype for correct operation and characterization. A flexible prototype method is described, using the overlay interconnect approach, for probing and verification. The overlay process builds the interconnect over the top of a bare die. An overview of the process is given. The overlay interconnect method has several... View full abstract»

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