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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 2 • Date June 1981

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Displaying Results 1 - 15 of 15
  • Foreword

    Publication Year: 1981, Page(s): 165
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    Freely Available from IEEE
  • Correction to "Computerized Thermal Analysis of Hybrid Circuits"

    Publication Year: 1981, Page(s): 230
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  • Correction "Connector Finishes:Tin in Place of Gold"

    Publication Year: 1981, Page(s): 230
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  • Humidity Test of Premolded Chip Carriers

    Publication Year: 1981, Page(s):210 - 213
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB)

    Premolded chip carrier packages made by AMPl containing test chips coated with various protective materials were humidity-tested at 85°C/85 percent relative humidity (RH) with a 40-V dc bias for 1000 h. The test chips were also packaged in plastic dual in-line packages (DIP's), and ceramic DIP's and tested at the same time for comparison. The purpose of this test was to gather preliminary inf... View full abstract»

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  • CRAY-1 Computer Technology

    Publication Year: 1981, Page(s):181 - 186
    Cited by:  Papers (11)  |  Patents (1)
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    Hardware and packaging technology which provide the high performance of the CRAY-I computer are reviewed. A brief overview of the computer is given, followed by a description of the computer circuits, packaging, power distribution, and cooling system. View full abstract»

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  • Graphical Solution for the Back Pressurization Method of Hermetic Test

    Publication Year: 1981, Page(s):217 - 224
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1176 KB)

    The back pressurization method for leak-testing hermetically sealed electronic packages requires gas-flow modeling to relate indicated leakage rates to true leak size. The molecular flow relationship which is appropriate for fine leak sizes is nonlinear and requires a numerical solution, which in actual test application may involve either many trial calculations or the use of approximations that l... View full abstract»

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  • Terminal and Cooling Requirements for LSI Packages

    Publication Year: 1981, Page(s):187 - 191
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (848 KB)

    As the level of digital circuit integration on integrated circuit (IC) chips increases, more input-output (I/0) terminals are required on the chip package. More terminals mean a larger conventional package. This can frustrate achievement of higher overall gate density on the printed circuit (PC) board assembly. Chip packages providing terminals as a function of package area or at reduced terminal ... View full abstract»

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  • Chip Carriers-Their Application and Future Direction

    Publication Year: 1981, Page(s):195 - 199
    Cited by:  Papers (4)  |  Patents (1)
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    The need for chip carriers and chip-carrier standards is reviewed. Chip-carrier telecommunications applications as well as thermal characteristics of chip carriers are presented. Impediments to chip-carrier applications as well as future directions are reviewed. View full abstract»

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  • Testing of Properties for Soldered Leadless Chip Carrier Assemblies

    Publication Year: 1981, Page(s):200 - 205
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1152 KB)

    The use of leadless chip carriers in soldered assemblies represents a relatively new device packaging/interconnection technology. There is little published material treating any of the physical properties of the solder attachment in a quantitative fashion. The application of leadless hermetic chip carriers to high reliability microelectronics prompted a joint preliminary investigation by RCA and S... View full abstract»

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  • High Density Multiwire Circuits Using Thinner Wires

    Publication Year: 1981, Page(s):224 - 229
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    High density Multiwire circuit technology which can lay two insulated wires between throughholes on 2.5 mm centers has been developed. To reduce crosstalk smaller diameter wires were adopted instead of conventional 0.16 mm diameter wires. Wire breakage and wiring mistakes, which occur in high density wiring, can result from improper wire tacking. A newly developed tackless wiring technique can red... View full abstract»

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  • Packaging Trade-Offs for an LSI-oriented Very High-Speed Computer, the HITAC M-200H

    Publication Year: 1981, Page(s):166 - 172
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1232 KB)

    Hardware technologies used and design considerations behind important design decisions in the development of the generalpurpose very high-speed computer, HITAC M-200H, are outlined. The logic and memory make extensive use of large-scale integration (LSI) technology. Trade-offs in LSI application to random logic result in the use of 416 circuit, 0.7 ns emitter-coupled logic (ECL) masterslice LSI's ... View full abstract»

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  • Low Energy LSI and Packaging for System Performance

    Publication Year: 1981, Page(s):173 - 180
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1696 KB)

    By defining "power.time products" of digital functional blocks, processor performance can be quantitatively expressed by a parameter which is the product of equivalent energy UB and the thermal resistance RthetaB. The reduction of UB.RthetaBthrough systemoriented large-scale integration (LSl) technology in both chips and packaging is necessary for raising the level... View full abstract»

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  • Chip Carrier Applications

    Publication Year: 1981, Page(s):192 - 195
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    The chip carrier package is gaining acceptance as a largescale integration (LSI) and very large-scale integration (VLSI) circuit package which can be integrated with medium-scale integration (MSI), small-scale integration (SSI), and passive components onto conventional printed wiring boards. In addition, the chip carrier package is being used to manufacture high density small modules which can be ... View full abstract»

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  • Low Cost Chip Carriers for the 1980's

    Publication Year: 1981, Page(s):205 - 209
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1280 KB)

    Most industry people are projecting an accelerated market penetration in the 1980's for the various forms of chip carriers as laid out by the Joint Electron Device Engineering Council (JEDEC) JCII-3 committee. Many papers have been written promoting its advantages over the old reliable dual in-line package (DIP)-advantages like size, weight, thermal, electrical, and reliability. A novel approach f... View full abstract»

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  • Migration of Silver from Silver-Loaded Polyimide Adhesive Chip Bonds at High Temperatures

    Publication Year: 1981, Page(s):214 - 216
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (560 KB)

    A degradation mechanism found at high temperatures in a commercial silver-loaded polyimide chip adhesive is discussed. The adhesive was used to attach semiconductor diodes to headers for potential use in the geothermal well probe program. Aging the mounted devices at 300°C for 1100 h resulted in a bias dependent migration of the silver out of the adhesive. This effect was accompanied by an in... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope