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Computer Aided Design Tools for Thermal Management, IEE Colloquium on

Date 15-15 Dec. 1989

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Displaying Results 1 - 7 of 7
  • Thermal management of electronics: problems and analytical techniques

    Publication Year: 1989, Page(s):4/1 - 410
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (399 KB)

    An adaptive and hierarchical steady-state, finite-difference technique is employed in a fast-action, thermal-analysis template to model electronic and electrical packages under different thermal loadings (i.e. temperature differences leading to high stresses). These resultant temperature, stress and strain distributions over such packages are presented in 3D colour isometric projections. The high ... View full abstract»

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  • The application of a computational fluid dynamics program, `FloTHERM', to electronic thermal analysis

    Publication Year: 1989, Page(s):3/1 - 3/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (104 KB)

    FloTHERM is a new CFD software system aimed at providing a design tool which can readily be applied to electronics thermal problems by users without special CFD knowledge or expertise. It makes use of well-established CFD solution techniques, packaged in a flexible and user-friendly software environment. Relevant features of FloTHERM include: fully-conservative finite-volume formulation of the equ... View full abstract»

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  • Design of defence electronics using MCAE

    Publication Year: 1989, Page(s):2/1 - 2/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (124 KB)

    MCAE can be used throughout the mechanical design of defence electronics. Although traditionally only used for predicting the structural integrity of a unit, a finite element model can be used to encompass the thermal design issues as well. As component miniaturization continues, typical PCB heat dissipations are likely to increase, hence the thermal specification of an LRU will soon overtake its ... View full abstract»

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  • Thermal management of electronic networks using TLM

    Publication Year: 1989, Page(s):1/1 - 1/4
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (176 KB)

    The heat transfer processes involved in the thermal management of electronic networks are complex. TLM (transmission line modelling) is an implementationally advantageous method of modelling heat transfer and related phenomena. The authors discuss the possibility and appropriateness of using the TLM technique to model aspects of heat dissipation in electronic networks. The following aspects of the... View full abstract»

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  • Effective thermal design and management

    Publication Year: 1989, Page(s):5/1 - 5/3
    Cited by:  Papers (3)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (132 KB)

    The packing density of components on printed circuit boards (PCB's) has increased dramatically recently and thermal constraints have become increasingly more important. Computer aided design (CAD) and computer aided engineering (CAE) tool vendors have been able to incorporate new tools to address the bottlenecks in the design process. Areas that have been addressed include circuit simulation and P... View full abstract»

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  • IEE Colloquium on `Computer Aided Design Tools for Thermal Management' (Digest No.153)

    Publication Year: 1989
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (20 KB)

    The following topics were dealt with: thermal management of electronic networks using TLM; defence electronics design with MCAE; computational fluid dynamics software for electronic thermal analysis; PCB design with thermal analysis CAD; and thermal analysis of aerospace equipment View full abstract»

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  • Thermal analysis and management of aerospace equipment using computer techniques

    Publication Year: 1989, Page(s):6/1 - 6/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (120 KB)

    Changes in electronic technologies have led to significant increases in the power densities of components. To ensure that component reliabilities are not degraded, these trends have to be matched by improvements in thermal management techniques, supported by quick and accurate computer thermal analysis tools. The author discusses the use and development of such tools at British Aerospace, such tha... View full abstract»

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