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IEE Colloquium on Advances in Interconnection Technology

18 Apr 1991

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Displaying Results 1 - 8 of 8
  • Addressing electrical and interconnection problems with discrete wiring

    Publication Year: 1991, Page(s):3/1 - 3/4
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (196 KB)

    Surface Mount Technology is becoming an essential tool in the design of high performance electronic systems. The older technologies such as multilayer boards have extreme difficulty meeting all requirements without compromise. For example, higher interconnection densities mean more layers, but this causes problems with manufacture, heat management, board thickness, and meeting the requirements of ... View full abstract»

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  • Trends and recent developments in mass soldering techniques for electronics assembly

    Publication Year: 1991, Page(s):2/1 - 2/2
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (108 KB)

    Outlines the latest developments and current trends in the PCB assembly industry. Since the advent of wave soldering, most of the major changes in the equipment have been brought about by SMT. This has required the development of complex waves to solder SMT components, i.e. dual waves, turbulent waves, etc. It has also required the development of a more controlled process, which has been achieved ... View full abstract»

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  • IEE Colloquium on `Advances in Interconnection Technology' (Digest No.082)

    Publication Year: 1991
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (16 KB)

    The following topics were dealt with: hybrid IC technology; fineline PCB technology; mass soldering; laser soldering; multichip modules; and opto hybrid technology View full abstract»

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  • Developments in silicon opto-hybrid technology for high performance opto-electronic modules

    Publication Year: 1991, Page(s):8/1 - 8/6
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (332 KB)

    To increase interconnection capabilities at all levels, new ways of packaging optical, optoelectronic and electronic components are vital. A possibility is to make use of hybrid multi-chip modules. Hybrid mounting techniques allow the independent optimisation of the individual optical and electronic components; InP lasers can be mixed with Si ICs and InGaAs photodetectors. In this way complex and ... View full abstract»

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  • High interconnection density-current trends

    Publication Year: 1991, Page(s):4/1 - 4/4
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (240 KB)

    Describes some trends in high interconnection density media, including fine-feature printed circuit boards (for fine-pitch surface mounted devices and for Multi-Chip Modules using unpackaged ICs-Chip-on-Board) and silicon motherboards, comparing the benefits and the limitations of the different options. Examples are given showing improvements in the desired attributes and means of overcoming probl... View full abstract»

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  • Implications for interconnect

    Publication Year: 1991, Page(s):1/1 - 1/6
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (228 KB)

    With non-UK manufactured semiconductors at the heart of electronics the way forward for the UK electronics industry now lies with using advanced semiconductors and other components rather than making them. And being successful will rest with adopting an agile approach to Interconnect Technology-every aspect of connecting components together to create electronic systems. Whilst the technical demand... View full abstract»

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  • Semiconductor lasers for microsoldering

    Publication Year: 1991, Page(s):6/1 - 6/4
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (164 KB)

    The minimal rise in substrate temperature reduces mechanical stress, the rapid melting and cooling of the solder prevents the formation of intermetallic compounds. Recent advances in semiconductor physics have brought about the availability of semiconductor laser diodes capable of delivering CW powers of 1 watt from single diodes and 5-10 watts CW from `multiple emitter' devices. These power sourc... View full abstract»

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  • The use of multichip module technology in system miniaturisation

    Publication Year: 1991, Page(s):7/1 - 7/3
    IEEE is not the copyright holder of this material | Click to expandAbstract | PDF file iconPDF (228 KB)

    Application examples of miniaturisation are presented, and indicate that the most effective way to capitalise on the advantages offered by hybrid and Multi-Chip Module (MCM) technologies is to begin the design process at the system design stage. Typically 40% of all costs of manufacture of electronic systems is spent on board to board connections, with backplanes, connectors, and packaging, and th... View full abstract»

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