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Electronic Components and Technology Conference, 1990. ., 40th

Date 20-23 May 1990

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  • 1990 Proceedings. 40th Electronic Components and Technology Conference (Cat. No.90CH2893-6)

    Publication Year: 1990
    Request permission for commercial reuse | PDF file iconPDF (24 KB)
    Freely Available from IEEE
  • A laser based system for tape automated bonding to integrated circuits

    Publication Year: 1990, Page(s):757 - 761 vol.1
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB)

    A laser-based process has been developed to bond tape automated bonding (TAB) leads to integrated circuit pads. This technology has many distinct advantages over conventional TAB bonding techniques, such as gang thermode bonding and single-point thermosonic bonding. TAB laser bonding is performed by positioning a focused laser beam over a lead and then pulsing the laser once, creating a reliable m... View full abstract»

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  • Lead inductance of ferromagnetic materials and a method to reduce inductance at low frequencies

    Publication Year: 1990, Page(s):1109 - 1112 vol.2
    Cited by:  Papers (5)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (224 KB)

    Data on the inductance of Alloy 42 and Kovar and its relationship to frequency are presented. The domain theory is applied to explain the relaxation phenomena of ferromagnetic materials vs. ferrites. The measured inductance of ferromagnetic materials and copper strips is compared with theoretical calculations. Also, a method of reducing the inductance of ferromagnetic materials at low frequencies ... View full abstract»

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  • Grain boundary sliding in surface mount solders during thermal cycling

    Publication Year: 1990, Page(s):491 - 495 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (892 KB)

    The growth of fatigue cracks in near-eutectic, surface-mount solder joints during cyclic, thermal displacement-controlled loading is reported. Ceramic leadless chip carriers (LLCC) are subjected to thermal fatigue with a frequency of 1/hr and over two ranges of temperature: -36°C to 125°C and -20°C to 75°C. Surfaces and cross-sections of the solder joints are inspected using scanni... View full abstract»

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  • A new inner lead bonding scheme for tape automated bonding (TAB)

    Publication Year: 1990, Page(s):754 - 756 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (152 KB)

    A TAB inner-lead bonding configuration consisting of bumped tape bonded to bumped die has been developed. The concept was demonstrated on an Au-Cu metallurgy in low- and high-lead-count packages. Extensive reliability investigations were performed using low-lead-count plastic packages as test vehicles. This configuration was shown to offer distinct advantages over the more conventional planar-type... View full abstract»

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  • A new power cycling technique for accelerated reliability evaluation of plated-through-holes and interconnects in PCBs

    Publication Year: 1990, Page(s):426 - 435 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (820 KB)

    A simple PCT (power cycling technique) that can rapidly assess the reliability of copper-plated-through-holes and associated interconnects in complex PCBs (printed circuit boards) has been developed. This PCT has been found to have the ability to quickly discriminate between barrels of good and poor reliability. Failure modes observed in PCT and MIL-T-shock test are identical; thus, a correlation ... View full abstract»

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  • Signal integrity analysis of high-speed, high-pin-count digital packages

    Publication Year: 1990, Page(s):1098 - 1107 vol.2
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    A transmission-line model of package traces in conjunction with a lattice diagram technique is used to study the signal integrity problem in digital systems using high-speed, high-pin-count packages. Formulae which predict the signal degradations, including overshoot/undershoot and edge-rate degradation, are presented for two different high-speed digital system interconnect schemes (parallel termi... View full abstract»

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  • Single-mode fiber packaging for semiconductor optical devices

    Publication Year: 1990, Page(s):193 - 199 vol.1
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (472 KB)

    The authors describe an approach which increases package assembly alignment tolerances substantially while demonstrating coupling efficiencies as high as 40%. This has been accomplished by utilizing a spherical lens to couple from the device into single-mode fiber. The ball lens is mounted directly on the chip carrier for maximum thermal and mechanical stability and is aligned mechanically rather ... View full abstract»

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  • Straddle-board modeling of SMT joint behaviors

    Publication Year: 1990, Page(s):981 - 988 vol.2
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (652 KB)

    Straddle-board specimens consisting of a chip carrier connected by J-leads to a printed wiring board were tested isothermally at room temperature. Thermal expansions were simulated by controlling the deflection of the bisectioned printed wiring board. Initial results are presented from using the straddle-board configuration for material response and fatigue life analysis of actual surface-mounted ... View full abstract»

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  • Creep-fatigue modelling for solder-joint reliability predictions including the microstructural evolution of the solder

    Publication Year: 1990, Page(s):482 - 490 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (900 KB)

    A model is developed for the effect of microstructural evolution (precipitation and dissolution of tin particles) during the thermal-cycling fatigue of low-tin, lead-tin solders. It is shown that the effect of changing the cycle frequency is intertwined with the effect of change the cyclic temperature limits. Because both the precipitation rate and the dissolution rate depend on temperature, it is... View full abstract»

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  • Multiphase imide block copolymers: new materials for microelectronics applications

    Publication Year: 1990, Page(s):706 - 710 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (248 KB)

    Imide block copolymers were investigated as a means of lowering the dielectric constant and improving the polymer-polymer adhesion of poly(4,4'-oxydiphenylenepyromellitimide) (PMDA/ODA). Poly(perfluoroalkylenearyl ether) (PFAAE) was used as a coblock to introduce fluorine and lower the dielectric constant of PMDA/ODA. Poly(aryl ether-phenylquinoxaline) (PQE) coblocks were incorporated to improve p... View full abstract»

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  • Validation of module assembly physical models

    Publication Year: 1990, Page(s):1071 - 1076 vol.2
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (504 KB)

    Some typical models used in the assembly of electronic modules are presented along with data establishing the validity of these models. Six cases are examined: two cases of PTH/PWB (plated-through-hole/printed wiring board) model validation: SMT (surface mount technology) reliability prediction using the matrix creep method; prediction of creep rupture times of SMT butt joints; PGA (pin grid array... View full abstract»

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  • Large scale multilayer glass-ceramic substrate for supercomputer

    Publication Year: 1990, Page(s):76 - 83 vol.1
    Cited by:  Papers (3)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    A large-scale multilayer glass-ceramic (MGC) substrate, which has a low dielectric constant (7.8) and a high flexural strength, has been developed by means of highly accurate green-sheet technology. The multilayer substrate has the following characteristics: (1) the substrate size is 225 mm×225 mm, 5.5-mm thick; (2) low electrical resistivity (3 μΩ-cm) can be realized by using a gol... View full abstract»

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  • New polyimide for multi-chip module application

    Publication Year: 1990, Page(s):751 - 753 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (160 KB)

    P-terphenyltetracarboxylic dianhydride (p-TPDA), which has a rodlike structure, has been developed as a raw material for polyimides in order to reduce the propagation delay time associated with polyimide packaging for multichip modules. The coefficient of thermal expansion (CTE) of the polyimides derived from p-TPDA is approximately 2×10 -6. This is much lower than that of convent... View full abstract»

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  • Technology developments for terpene cleaning of electronic assemblies

    Publication Year: 1990, Page(s):253 - 257 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed at AT&T's Merrimack Valley manufacturing location in North Andover, MA. This facility, which represents a viable alternative to chlorofluorocarbon cleaning, is used to remove rosin-based-solder paste residues after reflow soldering of su... View full abstract»

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  • Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates

    Publication Year: 1990, Page(s):418 - 425 vol.1
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (580 KB)

    A method for the prediction of solder-joint cycle life in surface-mount assemblies is presented. It is based on the conversion of plastic solder shear strain into cycle life with an equation derived by W. Engelmaier (1983). The shear strain is normally calculated from temperature and TCE (thermal coefficient of expansion) differentials between the package and interconnect board without considerati... View full abstract»

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  • Calculation of voltage drops in the vias of a multichip package

    Publication Year: 1990, Page(s):157 - 162 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (284 KB)

    A methodology for calculation of the voltage drops in the vias of a multichip package is presented. The vias are treated as lumped-circuit elements, and the excess capacitance and inductance of the vias are not considered. Numerical techniques were employed to determine the voltage and current waveforms of the signal path between two chips. After the current waveforms for the vias were determined,... View full abstract»

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  • Advances in military hybrids

    Publication Year: 1990, Page(s):1406 - 1406 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB)

    The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, ... View full abstract»

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  • A lens adjustable laser diode package

    Publication Year: 1990, Page(s):214 - 217 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (308 KB)

    A lens-adjustable method allowing correction of optical offaxial alignment to the correct axis position is proposed. The method is effective even after the lens is fixed. The lens-adjustable structure utilizes a special lens holder, a thin-walled pipe. The pipe is deformed plastically at its root and modified to achieve maximum fiber output power. This method is effective even if a 100-μm offax... View full abstract»

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  • A multidisciplinary approach to PWB design

    Publication Year: 1990, Page(s):1090 - 1096 vol.2
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (700 KB)

    At Georgia Tech, a research team is collaborating with the electronics industry to develop a prototype integrated E/MCAD (electrical/mechanical computer-aided design) PWB (printed wiring board) design system called thermal structural electromagnetic testability (TSET). TSET, responding to this E/MCAD concept, proposes an integrated information framework which employs an executive-centered informat... View full abstract»

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  • Materials/processing approaches to phase stabilization of thermally conductive pastes

    Publication Year: 1990, Page(s):886 - 892
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (388 KB)

    Previously reported thermally conductive pastes based on simple dispersions of boron nitride particles in mineral oil were observed to undergo phase separation when stressed thermal-mechanically. Such stressing of thermal pastes was carried out to simulate the mechanical shearing action imposed on such pastes as a result of the anticipated differential motion of contacted heat-transfer surfaces an... View full abstract»

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  • Trends in laser packaging

    Publication Year: 1990, Page(s):185 - 192 vol.1
    Cited by:  Papers (24)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (788 KB)

    The author reviews the advances in the electrical, mechanical, and optical design of laser packages over the past few years and indicates the current state of the art. The examples focus on how changes in the design and materials have resulted in performance improvements and cost reductions. A list of desirable future laser packages is presented View full abstract»

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  • A high performance electrical and optical interconnection technology

    Publication Year: 1990, Page(s):974 - 979 vol.2
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (376 KB)

    A printed circuit board technology has been developed for high-speed, high-density electronic circuits built from components with high power dissipation. The technology consists of a metal core with discrete conductors at both sides. Low thermal resistance has been realized by placing the component packages against the metal core. The edges of the metal can be contacted to heat sinks or conducting... View full abstract»

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  • Damage storage measurement in Pb-Sn solder

    Publication Year: 1990, Page(s):477 - 481 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (396 KB)

    The effects of hold time, stress range, mean stress, and mechanical history were investigated in 37Pb-63Sn solder in the as-cast condition at 27°C and 100°C. Under some short-hold-time conditions at both temperatures, the anelastic strain storage prevents the storage of creep damage. This sets a limit on how much a hold time can be shortened because at short enough hold times, the damage s... View full abstract»

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  • The evolution of metallized film capacitors towards surface mounting technology

    Publication Year: 1990, Page(s):1025 - 1033 vol.2
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (316 KB)

    It has been demonstrated that plastic film chip capacitors are suitable for SMT (surface-mount technology) requirements. The only drawback is a mechanical size that is three times larger than the MLC (multilayer capacitor) chip, limiting the use of the film chips in the field of mixed technology (leaded+leadless). Film chip becomes a necessity where a medium-high capacitance value is required with... View full abstract»

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