40th Conference Proceedings on Electronic Components and Technology

20-23 May 1990

Filter Results

Displaying Results 1 - 25 of 166
  • 1990 Proceedings. 40th Electronic Components and Technology Conference (Cat. No.90CH2893-6)

    Publication Year: 1990
    Request permission for commercial reuse | PDF file iconPDF (24 KB)
    Freely Available from IEEE
  • New military qualification testing procedures for cleaning agent alternatives to CFCs

    Publication Year: 1990, Page(s):261 - 263 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (172 KB)

    The joint industry/military/EPA (US Environmental Protection Agency) program to evaluate alternatives to CCs and CFCs (chlorocarbons and chlorofluorocarbons) for printed board assembly cleaning is described. Phase one was completed in 1989 and established three measures for determining circuit-board cleanliness; surface insulation resistance (SIR), ionic levels (for inorganics), and a novel rosin-... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Compatibility testing procedures and results for plastics and elastomers used with alternative cleaning agents

    Publication Year: 1990, Page(s):258 - 260 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (140 KB)

    Low-ozone-depleting cleaning agents are being developed to replace chlorofluorocarbon (CFC)-based solvents for electronics cleaning. In general, the alternative cleaning agents are chemically more aggressive than the conventional CFC-113 blends. Manufacturers of electronic components should therefore be concerned about the compatibility of the polymeric construction materials they choose to use in... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Mullite ceramic substrate for thin-film application

    Publication Year: 1990, Page(s):68 - 75 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    The advantages of mullite ceramic for thin-film application are examined. Using homogeneous powder, a dense mullite substrate consisting of fine mullite grains was provided without the addition of a sintering aid. The properties obtained are superior to those of the mullite presented by M. Horiuchi et al. (1988) and a conventional alumina for application to packages and substrates: low dielectric ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Technology developments for terpene cleaning of electronic assemblies

    Publication Year: 1990, Page(s):253 - 257 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed at AT&T's Merrimack Valley manufacturing location in North Andover, MA. This facility, which represents a viable alternative to chlorofluorocarbon cleaning, is used to remove rosin-based-solder paste residues after reflow soldering of su... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Development of ultra-thin surface mounting IC package (0.8 mm thick TQFP)

    Publication Year: 1990, Page(s):302 - 307 vol.1
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (444 KB)

    A TQFP (thin quad flat package) with a package size of 10×10 mm and a maximum package thickness of 0.8 mm has been developed to meet the need for lower profiles in surface-mounting packages. For a package thickness of 1.0 mm, the conventional lead-frame thickness and chip thickness are sufficient. However, when the package thickness is reduced to 0.8 mm, a reduction in at least one of the co... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use

    Publication Year: 1990, Page(s):901 - 906 vol.2
    Cited by:  Papers (1)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4' diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impre... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Flip-chip soldering to bare copper circuits

    Publication Year: 1990, Page(s):333 - 337 vol.1
    Cited by:  Papers (5)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1244 KB)

    The authors describe a process for providing high-yield/high-reliability C4 (controlled collapse chip connection) joining to bare copper circuitry. A study was undertaken in the course of implementing a major change in IBM's metallized ceramic (MC) and metallized ceramic-polyimide (MCP) production line. It involved joining chips with 95/5 Pb/Sn C4 solder bumps to bare copper pads on substrates to ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A new all-fiber fused taper polarization couplers

    Publication Year: 1990, Page(s):64 - 67 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (244 KB)

    All-fiber fused-taper polarization couplers with a package size of only 30 mm (length)×3 mm (diameter) have been fabricated with the conventional single-mode fiber. With unpolarized light exciting the input port of the device, the polarizing extinction ratios that are measured directly at both output ports are better than 20 dB. It is shown that this device can actually split two orthogonall... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Semi-aqueous cleaning: an alternative to halogenated solvents

    Publication Year: 1990, Page(s):247 - 252 vol.1
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    Terpene-based formulations have been shown to be the only viable substitutes for chlorofluorocarbons (CFCs) and other halogenated solvents in electronic defluxing applications. Terpene-based cleaners are safe for employees and the environment, they are effective for conventional and surface-mount technology, and they are cost competitive with CFCs. High-performance terpene cleaners have beep prove... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Development of robust hybrids for smart skin avionics

    Publication Year: 1990, Page(s):131 - 139 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart sk... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • YBa2Cu3O6-x-based thick film resistor

    Publication Year: 1990, Page(s):298 - 301 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (308 KB)

    Owing to the low resistivity and small positive temperature coefficient of resistivity around room temperature of the YBa2Cu3O7-x superconductor, thick film resistor paste is prepared by utilizing YBa2Cu3O 7-x as the functional phase of the resistor. Ag2O and PbO are added to increase the density of the fired film and to ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Reliability assurance of laser-fiber coupling in an undersea lightwave package

    Publication Year: 1990, Page(s):42 - 43 vol.1
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (108 KB)

    Reliability assurance of a laser package for undersea lightwave communication systems is discussed. The difficulty in assuring long life on recent-technology components such as a laser package is the lack of extensive experience with failure modes. For this reason, an extensive testing program was conducted to detect and assess the possibility of failure of the package in the lightwave system. The... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Mechanism of electro-migration in ceramic package induced by chip-coating polyimide

    Publication Year: 1990, Page(s):894 - 899 vol.2
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (412 KB)

    The mechanism of electromigration between the inner leads in a ceramic package was investigated. The short-circuit failure between the neighboring pins of the ceramic package, in which a polyimide-coated LSI chip was assembled, was observed in tests after burn in. An analysis of the bypass which caused the failure found that the composition of the bypass was electromigrated nickel from the inner l... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Low thermal resistance AlN PGA with low inductance of power lines

    Publication Year: 1990, Page(s):327 - 332 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (404 KB)

    A low-thermal-resistance and high-speed pin-grid-array (PGA) package with low-inductance power lines was proposed, and its feasibility was confirmed. To obtain low-inductance power lines, the wiring system in the package kept power-line layers and signal-line layers separate. Low inductance of power lines was realized by using conductive layers with a large area in an aluminium nitride (AlN) subst... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Developments in fiber optic sensor design

    Publication Year: 1990, Page(s):60 - 63 vol.1
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (308 KB)

    A wide range of indirect phase sensors which permit sensing of most common industrial physical measurands has been developed. Porous glass fiber research efforts show the potential for developing fibers capable of making photometric, spectrometric, and perhaps chromatographic measurements on gaseous and liquid substances. Infrared-fiber development has allowed the emergence of a variety of infrare... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Assessment of aqueous cleaning of PWAs with wave and reflow soldered components

    Publication Year: 1990, Page(s):236 - 246 vol.1
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (844 KB)

    The authors report results obtained using production machines in a test program that started in the first quarter of 1989. Chemical and physical evaluation of different kinds of commercial water-soluble solder creams and fluxes was first performed. Three products were selected and subjected to test in order to qualify their application in the professional field for wave soldering and reflow proces... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Signal integrity analysis of high-speed, high-pin-count digital packages

    Publication Year: 1990, Page(s):1098 - 1107 vol.2
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    A transmission-line model of package traces in conjunction with a lattice diagram technique is used to study the signal integrity problem in digital systems using high-speed, high-pin-count packages. Formulae which predict the signal degradations, including overshoot/undershoot and edge-rate degradation, are presented for two different high-speed digital system interconnect schemes (parallel termi... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Low temperature co-fired glass-ceramic, high-density-interconnect, substrate with improved thermal management

    Publication Year: 1990, Page(s):122 - 130 vol.1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (688 KB)

    A hybrid integrated regulator/modulator with a digital and analog signal bus system for power conditioning of a transmit/receive module having a density figure of merit of 69 W/in3 and 845 W/lb is described. High-density multichip power conditioning modules were designed using the Green Tape system, a low-temperature glass-ceramic substrate technology, as the base substrate. The design ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design and performance of high-reliability double-layer capacitors

    Publication Year: 1990, Page(s):289 - 297 vol.1
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    The development, testing, and use of a highly reliable double-layer capacitor component designed for operation in the range of -55° to 85°C are described. This component offers a welded tantalum package with an innovative design to provide long life with stable electrical performance. Details of the design are presented along with life- and stress-test data. Unique characteristics are disc... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Self aligned, flip chip assembly of photonic devices with electrical and optical connections

    Publication Year: 1990, Page(s):34 - 41 vol.1
    Cited by:  Papers (9)  |  Patents (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (684 KB)

    Self-aligned flip-chip assembly using solder bump bonding has been applied to photonic circuits, resulting in several important advantages, including high precision, excellent ruggedness, and uncritical final assembly. Experiments with lithium niobate integrated optical chips and single-mode optical fibers have demonstrated that the optical coupling loss due to misalignment can be held to less tha... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Materials/processing approaches to phase stabilization of thermally conductive pastes

    Publication Year: 1990, Page(s):886 - 892
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (388 KB)

    Previously reported thermally conductive pastes based on simple dispersions of boron nitride particles in mineral oil were observed to undergo phase separation when stressed thermal-mechanically. Such stressing of thermal pastes was carried out to simulate the mechanical shearing action imposed on such pastes as a result of the anticipated differential motion of contacted heat-transfer surfaces an... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Parametric shifts in devices: role of packaging variables and some novel solutions

    Publication Year: 1990, Page(s):322 - 326 vol.1
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    The resistance-shift phenomena typically encountered in precision analog devices such as operational amplifiers which use the BiFET structure is discussed and resolved. A test chip consisting of fourteen implant resistors acting as piezoelectric strain gauges and temperature-sensing diodes for accurate recording of chip temperature was designed and fabricated. The incremental stressing effect of e... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Predictions of solder joint fatigue life

    Publication Year: 1990, Page(s):351 - 359 vol.1
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (708 KB)

    Procedures used to predict solder-joint life from calculations of the joint strains and low-cycle fatigue data are described. The fatigue lives of chip-carrier/printed-wiring-board joints are predicted and compared to measured values. This prediction utilizes a finite-element analysis of the string distributions in a typical joint acted upon by an imposed displacement. These strains are then used ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Planar waveguide devices on silicon

    Publication Year: 1990, Page(s):55 - 59 vol.1
    Cited by:  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (416 KB)

    A wide variety of planar optical waveguide devices were developed based on silica-glass-on-silicon technology. High-performance waveguides with low loss and precisely controlled geometry are formed on silicon substrates by a combination of flame hydrolysis deposition and photolithographic and reactive ion etching processes. This optical-fiber-compatible planar waveguide technology is flexible enou... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.