IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | Sign In

Author Search^beta | Advanced Search | Preferences | | More Search Options

Browse Conference Publications > Electronic Packaging Technolog ...

Electronic Packaging Technology, 2005 6th International Conference on

| Create Account

IEEE Account

Change Username/Password
Update Address

Purchase Details

Payment Options
Order History
Access Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical Interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.

Please enter a valid username or password.

For Institutional Users:

More Search Options

Electronic Packaging Technology, 2005 6th International Conference on

Date Aug. 30 2005-Sept. 2 2005

Quick Links

Filter Results

You have selected:

You have selected:

You have selected:

Title History

Conference committee

Real time stress monitoring in reflow solder: Cu thin films in Si(111)

Solder Joint Reliability of Sn-Ag-Cu BGA and Sn-Pb Solder Paste

Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning

Fast characterization for moisture properties of moulding compounds: influence of temperature and humidity

CVD diamond film sink for high power MCMs

Effects of the electric field on Ni-induced crystallization in field-aided lateral crystallization process

An application of MCM technology

Parametric cost estimating: a practical independent method of estimating the manufacturing cost of chips to modules in the Peoples Republic of China

Flexible Silicon Microneedles Array for Micro Fluid Transfer

Plasma considerations prior to wire bonding in advanced packaging

Study on Life Distributions of the Elements Based on Rough Function Theory

Simulation study on precision vibration reduction system for working stage of lithography

Nano-silver paste with low roasting temperature

Synthesis of undercoat with high temperature and humidity resistance for resistor

Thermal Fatigue Failure Analysis of Copper Interconnects under Alternating Currents

Structural Similarity as a Method to Reduce Qualification Tests

Characterization of Interface Strength as function of Temperature and Moisture Conditions

Prediction of Delamination in Micro-electronic Packages

Detecting and Analyzing Wafer Bump Voids with X-Ray Inspection

Study of the effects of molding pressure on the warpage of HVQFN packages

Effect of Die Bonding on MEMS Characteristics: Cell Library Study

The lithography with low-COO and high-performance for advanced packaging

Analysis of heat dissipation performance of CVD diamond film's sink for 3D-MCM

Study on Angle Deviation for Coupling Loss in Fiber Collimator Packaging

IEEE Account

Purchase Details

Profile Information

Need Help?