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Development of low temperature processing thermoplastic intrinsically conductive polymer

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3 Author(s)
Chow, L.L.W. ; Dept of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China ; Li, J. ; Yuen, M.M.F.

To find an alternative to reliable eutectic solder interconnects for electronics, MEMS and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50°C and it exhibits stable resistance with gold under Jedec level 1, 85°C/85% relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference: