Cart (Loading....) | Create Account
Close category search window
 

High density substrates and packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Porter, E. ; HiDEC, Arkansas Univ., Fayetteville, AR, USA ; Brown, B. ; Naseem, H. ; Schaper, L.

Summary form only given. The ideal package for direct chip attachment, from a thermal and mechanical viewpoint is silicon. Unfortunately, this material is produced in formats no larger than 300 mm in diameter. A research program is currently under way to look at alternative substrate materials that are well suited to MCM-D/L processing. Ideally, the candidate would be of a low cost, off-the-shelf large format (400 mm square) variety, able to withstand the high temperatures and chemicals commonly used in thin-film processing. This paper details a program developed by a consortium of large area processing vendors to evaluate materials as a base for RF and high frequency applications. Specifics on the materials chosen and methods used to test them are provided. The first task is to identify possible candidate base materials that could be used given certain requirements. Second is to evaluate their resistance to various chemicals. Third is to determine the materials' dimensional stability. This is accomplished by running test specimens through thin film processing and determining if warpage occurs after steps involving extreme temperature cycles such as dielectric curing. One of the most sensitive indicators of dimensional instability occurs during photolithography, when the metal or dielectric pattern is being transferred. If a material were to shrink or expand, evidence of this occurs when trying to position alignment markers correctly. Should the materials pass these preliminary tests, actual test vehicles may be built to determine the material viability under electrical and reliability testing

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.