By Topic

Volumetric description of dip solder joints from range data

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Y. Takagi ; Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan ; G. Medioni

Dip solder joints exhibit a variety of complex shapes, making inspection by traditional representation methods difficult. Traditional approaches use various features of 2D images to represent joint shape; however, correct 3-D representation is essential when analyzing joint shape for visual inspection. We present a method of using generalized cylinders (GCs) to obtain a 3-D representation of a solder joint from the joint's range image. This method is based on symmetry detection. B-spline contour representation allows analytical detection of a symmetry axis that is used as a basis for the GC axis. In addition, we present a B-spline fitting method that uses an initial line fitting procedure. The contour of the cross section is expressed as an ellipse using an ellipse-specified conic fitting method. Correct representations for over 53 test sample range images were obtained

Published in:

Applications of Computer Vision, 1998. WACV '98. Proceedings., Fourth IEEE Workshop on

Date of Conference:

19-21 Oct 1998