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Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

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9 Author(s)
Jeong, J.W. ; Div. of Electron. Mater., Korea Inst. of Sci. & Technol., Seoul, South Korea ; Ju, B.-K. ; Lee, D.J. ; Lee, Y.H.
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Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on 0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10/sup -7/ torr vacuum level.

Published in:

Vacuum Microelectronics Conference, 1998. Eleventh International

Date of Conference:

19-24 July 1998