Cart (Loading....) | Create Account
Close category search window
 

Understanding heat transfer in the lead-on-chip die bonding process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Behler, Stefan ; ESEC SA, Switzerland

Temperature is, besides pressure and bonding time, the key parameter controlling the lead-on-chip (LOC) die bonding process. It determines how fast the thermoplastic adhesive melts and thus how small the minimum lamination time can be. On the other hand, overheating the LOC tape may cause bubbles or decomposition of the polymers. Therefore, the absolute temperature of the LOC tape is an important issue. The paper describes the measurement of the evolution of temperature in the bonding process using a temperature sensor located between the die surface and the LOC tape. The experimental data is compared with numerical calculations. The paper concludes with analysis of how heat transfer is influenced by the thermal properties of the heated bonding tools and the thermal contact conductance between package and tools

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.