By Topic

Optimized Micro-Channel Design for Stacked 3-D-ICs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Bing Shi ; Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA ; Srivastava, A.

The three dimensional circuit (3-D-IC) achieves high performance by stacking several layers of active electronic components vertically. Despite its impact on performance improvement, 3-D-IC also brings great challenges to chip thermal management due to its high heat density. Microchannel-based liquid cooling shows great potential in removing the high density heat inside 3-D circuits. The current microchannel heat sink designs spread the entire surface to be cooled with microchannels. This approach, though it provides sufficient cooling, consumes significant amount of extra cooling power. In this paper, we investigate the design of non-uniformly distributed microchannel cooling systems which provide sufficient cooling with less cooling power. The experiments show that, compared with the conventional design which spreads microchannels all over the chip, our non-uniform microchannel design achieves up to 80% cooling power savings.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:33 ,  Issue: 1 )