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Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes

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7 Author(s)
Chuen-De Wang ; Dept. of Electr. of Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Yi-Min Yu ; De Paulis, F. ; Scogna, A.C.
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The ground surface perturbation lattice (GSPL) structure is investigated to suppress power noise in the power distribution network of mixed signal circuits. In order to enhance the bandwidth of the noise suppression, the GSPL structure is implemented by using multiple vias in the mushroom-like electromagnetic bandgap structure. Under the concept of multiple vias, the lower and upper bound cutoff frequencies of the bandgap are influenced by the position of the vias. An optimum position for the vias is found to achieve maximum stopband bandwidth. In this paper, the stopband mechanism of GSPL structure is investigated and the corresponding equivalent circuit model is proposed to quickly predict the lower and upper bound cutoff frequencies. Suitable test boards are fabricated and measured to demonstrate the accuracy of the design concept. The result shows that there is a good consistency between simulated, modeled, and measured results.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 2 )

Date of Publication:

Feb. 2012

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