By Topic

A 5.3 µW contact monitoring sensor with BCC electrode and MICS antenna for energy efficient unified WBAN transceiver

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Hyunwoo Cho ; Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea ; Joonsung Bae ; Kiseok Song ; Hoi-Jun Yoo

A low power contact monitoring sensor for an energy efficient implantable and wearable wireless body-area-network (WBAN) transceiver is implemented in 0.18 μm CMOS process. The transceiver utilizes 30 - 70 MHz for the body channel communication (BCC) and 402 - 405 MHz for the medical implant communication service (MICS) with a pattern-printed electrode interface for operating as both BCC electrode and MICS antenna. The contact monitoring sensor adopts the reflection wave detection technique to compensate for the channel quality degradation due to the variation of the contact distance between the electrode and the human body. The reflection wave detection is achieved by an energy efficient envelope detector and a 2-bit ADC with a programmable reference voltage. It leads to mitigate both the linearity and sensitivity requirements of the receiver front-end by more than 10 dB. As a result, with the power consumption of 5.3 μW, the proposed contact monitoring sensor reduces the power consumption of the LNA more than 70%.

Published in:

Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on

Date of Conference:

7-10 Aug. 2011