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The electromigration drift velocity has been measured, using the Blech–Kinsbron [Thin Solid Films 25, 327 (1975)] edge displacement method, for aluminum thin films under different thicknesses of anodization. The drift velocity is found to decrease with increasing anodization thickness. The results are interpreted in terms of a change in the self‐diffusivity of aluminum as a result of the compressive stresses imposed by the anodized layer. The effect of the variation of diffusivity with stress on the stress distribution within a drifting thin‐film sample is discussed.