Cart (Loading....) | Create Account
Close category search window
 

Cu/photosensitive-BCB thin-film multilayer technology for high-performance multichip modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Shimoto, T. ; Mater. Dev. Center, NEC Corp., Kawasaki, Japan ; Matsui, K. ; Utsumi, K.

A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCM's has been developed. The technology is based on Cu/photosensitive-BCB thin-film multilayer structure. The fabrication process is reduced by using the newly developed photosensitive-BCB, with a conventional photolithography process. The flexibility on design rules is allowed, because the Cu/BCB structure has the advantages of excellent planarization and low electrical resistance of signal line. The following long-term reliability tests were successfully done: thermal cycle (-45°C/125°C), high-temperature aging at 125°C, and high-temperature/humidity (85°C/85%). A prototype of the high density RISC module fabricated with the developed technology passed all the long-term reliability tests. The excellent electrical performance was also proved through the signal transmission tests with the prototype module

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 1 )

Date of Publication:

Feb 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.