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Ultra-Dense: an MCM-based 3-D digital signal processor

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6 Author(s)
Segelken, J.M. ; AT&T Bell Labs., Murray Hill, NJ, USA ; Wu, L.J. ; Lau, M.Y. ; Tai, K.L.
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The DSP3 Multiprocessor Project has produced a multi-GFLOP machine that is applicable to a variety of signal processing and pattern recognition problems. A companion program, the Ultra-Dense Project, is utilizing silicon-on-silicon multichip module (MCM) technology and innovative advanced packaging and physical design to achieve a parallel three-dimensional digital signal processor based on the DSP3. The authors present an overview and outline systems architecture the micro-interconnect technology (Si-on-Si MCM), and advances in physical design and packaging technology leading to an ultra-dense project demonstration

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:15 ,  Issue: 4 )

Date of Publication:

Aug 1992

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