Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

A universal sensor signal conditioning ASIC
Zheng Zheng   Raminder   Singh, J.   Sridhar, U.   Tan Khen-Sang  
Inst. of Microelectron.;

This paper appears in: ASICs, 1999. AP-ASIC '99. The First IEEE Asia Pacific Conference on
Publication Date: 1999
On page(s): 120-126
Meeting Date: 08/23/1999 - 08/25/1999
Location: Seoul, South Korea
ISBN: 0-7803-5705-1
References Cited: 4
INSPEC Accession Number: 6581915
Digital Object Identifier: 10.1109/APASIC.1999.824043
Current Version Published: 2002-08-06

Abstract
This paper described a low cost universal sensor signal condition ASIC for bridge type sensors. The ASIC was produced with standard double metal, double poly 0.8 μm silicon CMOS process and can correct the sensor's offset, offset temperature coefficient, sensitivity and sensitivity temperature coefficient. We have used this ASIC to signal condition silicon piezo-resistive pressure sensor to a total error of less than ±1% of the sensor's full scale output (FSO) in a temperature range of -40°C to 125°C. The ASIC can provide a low cost solution for the calibration of bridge type sensors such as pressure sensor, Hall effect sensor and MR/GMR sensor

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (288 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved