Nineteenth IEEE/CPMT International Electronics ManufacturingTechnology Symposium
This paper appears in: Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Publication Date: 14-16 Oct 1996
Meeting Date: 10/14/1996 - 10/16/1996
Location: Austin, TX, USA
ISBN: 0-7803-3642-9
INSPEC Accession Number: 5513753
Digital Object Identifier: 10.1109/IEMT.1996.559673
Current Version Published: 2002-08-06
Abstract
The following topics were dealt with: flip-chip developments;
semiconductor manufacturing cycle time; packaging; integrated design and
manufacture; cost modelling; high density substrates;
environmentally-conscious manufacturing; assembly and reliability;
manufacturing management; process modelling; process quality; and
process control
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