Invited Paper - Modeling RF Window Breakdown: from Vacuum Multipactor to RF Plasma
Kim, H.C.   Verboncoeur, J.P.   Lau, Y.Y.  

This paper appears in: Dielectrics and Electrical Insulation, IEEE Transactions on
Publication Date: Aug. 2007
Volume: 14,  Issue: 4
On page(s): 774-782
Location: Xi'an, China,
ISSN: 1070-9878
Digital Object Identifier: 10.1109/TDEI.2007.4286505
Current Version Published: 2007-08-08