A Fracture Mechanics Description of Stress-Wave Repair in Stiction-Failed Microcantilevers: Theory and Experiments
Leseman, Z.C.
Koppaka, S.B.
Mackin, T.J.
New Mexico Univ., Albuquerque;
This paper appears in: Microelectromechanical Systems, Journal of
Publication Date: Aug. 2007
Volume: 16,
Issue: 4
On page(s): 904-911
ISSN: 1057-7157
INSPEC Accession Number: 9620476
Digital Object Identifier: 10.1109/JMEMS.2006.883571
Current Version Published: 2007-08-08
Abstract
Microcantilever beams are frequently utilized as sensor platforms in microelectromechanical system devices. These highly compliant surface-micromachined structures generally fail by adhering to the underlying substrate during processing or subsequent operation. Such failures, which are commonly known as ldquostictionrdquo failures, can be prevented or repaired in a number of ways, including low adhesion coatings, rinsing with low surface energy agents, and active approaches such as laser irradiation. Gupta [ J. Microelectromech. Syst. vol. 13, pp. 696-700, 2004] recently demonstrated that stress waves could be used to repair stiction-failed structures. This paper extends the work of Gupta by developing a fracture mechanics theory of the repair process and compares that theory with corresponding experiments. We show that: 1) incremental crack growth is associated with each laser pulse, the extent of which is directly related to the laser fluence; 2) repeated pulsing fully repairs all of the microcantilevers; and 3) a fracture mechanics model accurately predicts the observed experimental results. [1664].
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