Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Simulation of wear of tape head contours
Lacey, C.   Talke, F.E.  
Center for Magnetic Recording Res., California Univ., San Diego, La Jolla, CA;

This paper appears in: Magnetics, IEEE Transactions on
Publication Date: Sep 1992
Volume: 28,  Issue: 5, Part 2
On page(s): 2554-2556
Meeting Date: 04/13/1992 - 04/16/1992
Location: St. Louis, MO, USA
ISSN: 0018-9464
References Cited: 4
CODEN: IEMGAQ
INSPEC Accession Number: 4338507
Digital Object Identifier: 10.1109/20.179554
Current Version Published: 2002-08-06

Abstract
A procedure whereby head wear can be numerically simulated is described. Wear is assumed to be proportional to a material constant times the contact pressure. Based on this assumption, the change in head contour due to wear is calculated in incremental steps starting from any initial contour. Simulation data are compared to an experimental measurement of head contour change due to wear. It is noted that the simulation of mechanical wear allows the evaluation of head geometries for their performance after wear. Wear of composites can be modeled with the simulation as well as preferential wear of thin-film head elements. Additionally, the model gives insight into the final lapping process for head manufacture

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (296 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved