Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Novel device structures by selective epitaxial growth (SEG)
Borland, J.O.  

This paper appears in: Electron Devices Meeting, 1987 International
Publication Date: 1987
Volume: 33,  On page(s): 12- 15
Current Version Published: 2005-08-09

Abstract
In the last few years, great interest has been generated in the selective growth of single crystal silicon in seed windows of an SiO2mask in order to fabricate novel device structures for VLSI/ULSI device technology. This increased interest in selective epitaxial growth (SEG) and its derivitives, simultaneous single/poly deposition (SSPD) and epitaxial lateral overgrowth (ELO) have led to several key processing breakthroughs that are currently changing the future direction and usage of silicon epitaxy. This paper will describe: 1) the key SEG processing breakthroughs that have occurred over the last 25 years, 2) some of the current limitations still observed with SEG processing and, 3) some of the novel device structures that are possible through the use of SEG techniques.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (360 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved