Modal and impact analysis of modern portable electronic products
Tan, L.B.
Ang, C.W.
Lim, C.T.
Tan, V.B.C.
Xiaowu Zhang
Dept. of Mech. Eng., Nat. Univ. of Singapore, Kent Ridge, Singapore;
This paper appears in: Electronic Components and Technology Conference, 2005. Proceedings. 55th
Publication Date: 31 May-3 June 2005
On page(s): 645- 653 Vol. 1
ISSN: 0569-5503
ISBN: 0-7803-8907-7
INSPEC Accession Number: 8588192
Digital Object Identifier: 10.1109/ECTC.2005.1441337
Current Version Published: 2005-06-20
Abstract
Drop impact responses of various modern cell-phones and portable digital assistants (PDAs) are analyzed in terms of the impact forces and accelerations and strains induced on the printed circuit boards (PCBs). The severity of impact induced on the interior PCBs and their electronic components can be determined from product-level drop tests. The results complement board level tests designed to simulate actual drop conditions experienced by PCBs within the portable products. This paper reports impact performances of recent portable products such as handphones from Samsung, Panasonic and Nokia as well as PDAs from Compaq and Sony. This is a continuation of the research done by Lim et al, 2003.
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