Wafer scale profiling of photonic integrated circuits
Hudgings, J.A.
Pipe, K.P.
Ram, R.J.
Phys. Dept., Mount Holyoke Coll., South Hadley, MA, USA;
This paper appears in: Lasers and Electro-Optics, 2003. CLEO '03. Conference on
Publication Date: 1-6 June 2003
On page(s): 2 pp.-
ISSN:
ISBN: 1-55752-748-2
INSPEC Accession Number: 8158650
Digital Object Identifier: 10.1109/CLEO.2003.1298028
Current Version Published: 2004-06-14
Abstract
We demonstrate a thermal profiling technique for wafer-scale testing of optical distribution in photonic integrated circuits. The technique is used to quantify the absorption coefficient of a subthreshold diode laser for varying operating conditions.
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