Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

Constructing 3D city models by merging aerial and ground views
Fruh, C.   Zakhor, A.  
California Univ., Berkeley, CA, USA;

This paper appears in: Computer Graphics and Applications, IEEE
Publication Date: Nov.-Dec. 2003
Volume: 23,  Issue: 6
On page(s): 52- 61
ISSN: 0272-1716
INSPEC Accession Number: 7781355
Digital Object Identifier: 10.1109/MCG.2003.1242382
Current Version Published: 2003-11-03

Abstract
We describe an approach to register and merge detailed facade models with a complementary airborne model. The airborne modeling process provides a half-meter resolution model with a bird's-eye view of the entire area, containing terrain profile and building tops. The ground-based modeling process results in a detailed model of the building facades. Using the DSM obtained from airborne laser scans, we localize the acquisition vehicle and register the ground-based facades to the airborne model by means of Monte Carlo localization (MCL). We merge the two models with different resolutions to obtain a 3D model.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (2134 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved