Polydimethylsioxane fluidic interconnects for microfluidic systems
Shifeng Li
Shaochen Chen
Mech. Eng. Dept., Univ. of Texas, Austin, TX, USA;
This paper appears in: Advanced Packaging, IEEE Transactions on
Publication Date: Aug. 2003
Volume: 26,
Issue: 3
On page(s): 242- 247
ISSN: 1521-3323
INSPEC Accession Number: 7758267
Digital Object Identifier: 10.1109/TADVP.2003.817961
Current Version Published: 2003-10-14
Abstract
This paper presents novel polydimethylsioxane (PDMS) based interconnects for microfluidic systems with a low dead volume. Through-hole type and "┌" type PDMS interconnects have been designed, fabricated, and tested for glass and plastic capillary tubing. Oxygen reactive ion etching and epoxy bonding methods are employed to bond PDMS interconnects to different substrate materials including silicon, glass, polymer and other thin film materials. Leakage pressure, leakage rate, and pull-out force are characterized for these interconnects. For reusable PDMS interconnects, the maximum leakage pressure reaches 510 kPa (75 psi) and the maximum pull-out force is about 800 mN. For nonreusable PDMS interconnects, the maximum leakage pressure is found to be 683 kPa (100 psi) and the maximum pull-out force is 2 N. For both types of PDMS interconnects, the leakage rate test demonstrates that the leakage is not detectable at a working pressure of 137 kPa (20 psi).
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