A nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation
Choonsup Lee
Yang, E.H.
Myung, N.V.
George, T.
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA;
This paper appears in: Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
Publication Date: 12-14 Aug. 2003
Volume: 2,
On page(s): 553- 556 vol. 2
ISSN:
ISBN: 0-7803-7976-4
INSPEC Accession Number: 7824404
Digital Object Identifier: 10.1109/NANO.2003.1230970
Current Version Published: 2003-09-15
Abstract
We have developed a new nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation. With this technique, it is possible to control the width, length, and depth of the nanochannels without the need for nanolithography. The use of sacrificial SiO2 layers allows the fabrication of centimeter-long nanochannels. In addition, the fabrication process is CMOS compatible. We have successfully fabricated an array of extremely long and narrow nanochannels (i.e. 10 mm long, 25 nm wide and 100 nm deep) with smooth inner surfaces.
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