Minimization of passive circuits losses realized on low resistivity silicon using micro-machining techniques and thick polymer layers
Bouchriha, F.
Grenier, K.
Dubuc, D.
Pons, P.
Plana, R.
Graffeuil, J.
Lab. d'Autom. et d'Anal. des Syst., CNRS, Toulouse, France;
This paper appears in: Microwave Symposium Digest, 2003 IEEE MTT-S International
Publication Date: 8-13 June 2003
Volume: 2,
On page(s): 959- 962 vol.2
ISSN: 0149-645X
ISBN: 0-7803-7695-1
INSPEC Accession Number: 7677304
Current Version Published: 2003-07-15
Abstract
In this paper, a novel technological solution using both silicon surface micromachining and thick polymer layer deposition on low resistivity silicon substrate (20 Ω/cm) has been investigated. The proposed structure achieves both a low attenuation level and a high quality factor. The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the gaps with the polymer BCB avoids a degradation of the effective permittivity.
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