Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC
Email/Printer Friendly Format  
 

CAD tool support for a multi-university SoC certificate program: The Digital Sandbox
Kroll, T.   Schmit, H.   Landis, D.  
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA;

This paper appears in: Microelectronic Systems Education, 2003. Proceedings. 2003 IEEE International Conference on
Publication Date: 1-2 June 2003
On page(s): 47- 48
ISSN:
ISBN: 0-7695-1973-3
INSPEC Accession Number: 7945985
Current Version Published: 2003-06-20

Abstract
The Pittsburgh Digital Greenhouse is sponsoring an educational support program to facilitate student IC design projects and laboratories at Carnegie Mellon University, the Pennsylvania State University, and the University of Pittsburgh. Students who have access to industry standard IC design tools that are integrated in a commercial design flow will be better prepared to enter the workforce. However, these capabilities are expensive to support and not generally available within Universities. The "Digital Sandbox" program described in this paper is facilitating education by providing and supporting modern VLSI/SoC CAD tools and industry standard design libraries.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (212 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved