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Simulating optoelectronics/MEMS hermetic packaging process with finite element method

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3 Author(s)
Chinmoy Saha ; Inst. for Manuf. Res., Wayne State Univ., Detroit, MI, USA ; Daming Zhang ; Sheng Li

For this work we have designed a hermetic packaging for a photonic Mini-module of 10Gb/s type. The device has a laser diode (LD) at the heart and other parts are mainly for mounting the LD light coupling paths and interconnects and providing mechanical stability as well as means of cooling. Another important part of the device is a photo diode (PD) which actually monitors the emitting optical, power of the LD. The main issue of this work is to determine the optical misalignment and coupling between the lasing line of LD and fiber core (about 9 microns in diameter), which is the direct measure of transmission efficiency of the device during the complete manufacturing process. We simulated the manufacturing process of the whole device and finally the hermetic sealing with ABAQUS finite element program. The materials for the actual package components are simplified with the available common materials before all the material data are available. The results of the thermo-mechanical FE analyses are obtained as the displacement and stress induced during the each step of seam welding process due to the coefficients of thermal expansion (CTE) mismatch of the different materials of different parts. The thermal stress generated during the testing and operational heating of the LD is not taken into account for this paper.

Published in:

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Date of Conference:

28-30 Oct. 2003