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A novel DRAM architecture as a low leakage alternative for SRAM caches in a 3D interconnect context.
Vignon, A.   Cosemans, S.   Dehaene, W.   Marchal, P.   Facchini, M.  
ESAT - MICAS Lab., K.U. Leuven, Leuven;

This paper appears in: Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Publication Date: 20-24 April 2009
On page(s): 929-933
Location: Nice,
ISSN: 1530-1591
ISBN: 978-1-4244-3781-8
INSPEC Accession Number: 10730290
Current Version Published: 2009-06-23

Abstract
This paper presents a DRAM architecture that improves the DRAM performance/power trade-off to increase their usability on low power chip design using 3D interconnect technology. The use of a finer matrix subdivision and buffering the bitline signal at the localblock level allows to reduce both the energy per access and the access time. The obtained performances match those of a typical low power SRAM, while achieving a significant area and static power reduction compared to these memories. The 128 kb memory architecture proposed here achieves an access time of 1.3 ns for a dynamic energy of less than 0.2 pJ per bit. A localized refresh mechanism allows gaining a factor of 10 in static power consumption associated with the cell, and a factor of 2 in area, when compared with an equivalent SRAM.

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