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A monitor interconnect and support subsystem for multicore processors
Madduri, S.   Vadlamani, R.   Burleson, W.   Tessier, R.  
Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA;

This paper appears in: Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Publication Date: 20-24 April 2009
On page(s): 761-766
Location: Nice,
ISSN: 1530-1591
ISBN: 978-1-4244-3781-8
INSPEC Accession Number: 10730517
Current Version Published: 2009-06-23

Abstract
In many current SoCs, the architectural interface to on-chip monitors is ad hoc and inefficient. In this paper, a new architectural approach which advocates the use of a separate low-overhead subsystem for monitors is described. A key aspect of this approach is an on-chip interconnect specifically designed for monitor data with different priority levels. The efficiency of our monitor interconnect is assessed for a multicore system using both an interconnect and a system-level simulator. Collected monitor information is used by a dedicated processor to control the frequency and voltage of individual multicore processors. Experimental results show that the new low-overhead subsystem facilitates employment of thermal and delay-aware dynamic voltage and frequency scaling.

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