Determination of Fracture Toughness of Underfill/Chip Interface With Digital Image Speckle Correlation Technique
Shi, X.Q.
Zhang, Y.L.
Zhou, W.
Singapore Inst. of Manuf. Technol.;
This paper appears in: Components and Packaging Technologies, IEEE Transactions on
Publication Date: March 2007
Volume: 30,
Issue: 1
On page(s): 101-109
Location: Seattle, WA, USA,
ISSN: 1521-3331
INSPEC Accession Number: 9370109
Digital Object Identifier: 10.1109/TCAPT.2007.892082
Current Version Published: 2007-04-02
Abstract
The layered packages are prone to multimode damages and failures when they are subjected to complicated and coupling environmental loading. As a result, fracture toughness is usually used as a fracture criterion to evaluate the reliability of polymer/inorganic interface. In this study, an in-situ/real-time micro-digital image speckle correlation (mu-DiSC) system was established and employed to determine the fracture toughness of underfill/chip interface involved in flip chip assembly. The tests were carried out over a wide range of temperatures and at various loading angles. In order to verify the finding of the mu-DiSC technique, an interface fracture mechanics based finite element model is implemented into ANSYS to calculate the values of crack-tip opening displacement of underfill/chip joint under different loading configurations. The results obtained from the simulation are found to be in good agreement with those measured by the mu-DiSC system, indicating that the system can be used as an accurate and effective experimental tool for the electronic packages. The fractographs, with respect to different temperatures and loading angles, are further discussed
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