Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
Abstract
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right
Email/Printer Friendly Format  
 

Neural-Network-Based Sensor Fusion of Optical Emission and Mass Spectroscopy Data for Real-Time Fault Detection in Reactive Ion Etching
Hong, S.J.   May, G.S.  

This paper appears in: Industrial Electronics, IEEE Transactions on
Publication Date: Aug. 2005
Volume: 52,  Issue: 4
On page(s): 1063- 1072
ISSN: 0278-0046
Digital Object Identifier: 10.1109/TIE.2005.851663
Current Version Published: 2005-08-01

Abstract
To achieve timely and accurate fault detection in reactive ion etching, neural networks (NNs) have been applied for the fusion of data generated by two in-situ sensors: optical emission spectroscopy (OES) and residual gas analysis (RGA). While etching is performed, OES and RGA data are simultaneously collected in real time. Several pre-determined, statistically significant wavelengths (for OES data) and atomic masses (for RGA signals) are monitored. These data are subsequently used for training NN-based time series models of process behavior. Such models, referred to herein as time series NNs (TSNNs), are realized using multilayered perceptron NNs. Results indicate that the TSNNs not only predict process parameters of interest, but also efficiently perform as sensor fusion of the in-situ sensor data.

Index Terms
Available to subscribers and IEEE members.

References
Available to subscribers and IEEE members.
Citing Documents
Available to subscribers and IEEE members.
You are not logged in.
Guests may access Abstract records free of charge.
Login
Username
Password
» Forgot your password?
Please remember to log out when you have finished your session.
You must log in to access:
• Advanced or Author Search
• CrossRef Search
• AbstractPlus Records
• Full Text PDF
• Full Text HTML
Access this document
Full Text: PDF (544 KB)
» Buy this document now
»  Learn more about
»  Learn more about
    purchasing articles
    and standards

Rights and Permissions
» Learn More
Download this citation
Available to subscribers and IEEE members.
 
arrow_leftView TOC   |arrow_leftPrevious Article   |  Next Articlearrow_right   |  Back to toparrow_up
Indexed by IEE Inspec
© Copyright 2010 IEEE – All Rights Reserved